Transfer mechanism and transfer method of semiconductor package
A pre-assembled, semiconductor technology, used in semiconductor/solid-state device manufacturing, conveyor objects, electrical components, etc., can solve problems such as reducing video detection efficiency
Inactive Publication Date: 2008-07-09
HANMI SEMICON CO LTD
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Therefore, since the fixed video inspection device 40 is used in half by a pair of acquisition tools 30, only half of the video inspection area is utilized when performing video inspection of semiconductor packages in the fixed video inspection device 40, thus reducing the efficiency of video detection
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[0029] Preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings.
[0030] In the following description about the present invention, detailed descriptions of known functions and integrated structures will be omitted when they make the gist of the present invention unclear.
[0031] FIG. 2 is a top view of a semiconductor package delivery mechanism according to a preferred embodiment of the present invention. In FIG. 2, reference symbols S, W and D denote a sawing machine, a washing machine and a drying machine, respectively. In addition, reference symbol T represents a tray, which is placed on the tray feeder so that the tray can move along a rail when semiconductor packages are supplied. Reference symbol M denotes a pallet setting machine on which pallets T are placed. The following description will focus on the delivery mechanism of the semiconductor package.
[0032] As shown in FIG. 2 , the semiconductor...
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The invention discloses a semiconductor package transfer mechanism and a semiconductor package transfer method. The semiconductor package transfer mechanism includes a plurality of pickup units, which are movable along a shaft extending in one direction and operated individually from each other, and a vision inspection apparatus installed across a moving route of the pickup unit in order to inspect defects of the semiconductor packages transferred thereto by means of the pickup units. The pickup units pick up a predetermined amount of semiconductor packages adapted for one-time photographing capacity of the vision inspection apparatus and instantly transfer the semiconductor packages to the vision inspection apparatus. Time delay and waiting time for the semiconductor packages are significantly reduced during the process of the handler system, thereby significantly improving the transfer efficiency and vision inspection efficiency.
Description
technical field [0001] The present invention relates to a transmission mechanism and a transmission method for semiconductor packages, in particular to a semiconductor package that is picked up by a pick-up unit and adapted to the one-shot capacity of a video detection device, and immediately delivered to the video detection device The delivery mechanism and delivery method of the prepack. Background technique [0002] Generally, to make a semiconductor package, a semiconductor chip having highly integrated circuits such as transistors and capacitors is attached to a semiconductor substrate made of silicon, and the upper surface of the semiconductor substrate is molded with resin. After the molding process, a ball grid array (BGA) as a lead frame is adhered to the lower surface of the semiconductor substrate so that the BGA is electrically connected to the semiconductor chip. Afterwards, the sawing process of the semiconductor substrate is completed by a sawing machine, so ...
Claims
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IPC IPC(8): H01L21/68H01L21/00H01L21/677
CPCH01L21/67715H01L21/67236H01L21/67706H01L21/67288H01L21/68
Inventor 郑显权金硕培
Owner HANMI SEMICON CO LTD