Surface contact type sandwich circuit protection device and making method thereof

Abstract

The protection set comprises the first metal layer, the second metal layer, the first conductance mechanism, the composite-plating layer, the third metal layer and the second conductance mechanism. The first metal layer comprises the first component part and the second component part with mutual isolation and the first insulation layer above the first metal layer. The second metal layer is above the first insulation layer. The first conductance mechanism makes the ducing between the second metal layer and the first component part of the first metal layer. The composite-plating layer containing carbon black is located above the second metal layer. The second conductance mechanism makes the ducing between the third metal layer and the second component part of the first metal layer. The protection set forms good contact between the metal layer and the composite material, lowering the interfacial resistance so as to obtain the good protecting effect.

Description

【Technical field】 [0001] The invention relates to a surface-adhesive laminated protection device and its manufacturing method, especially a surface-adhesive polymer-based circuit protection device with positive temperature coefficient thermistor (Positive Temperature Coefficient, hereinafter referred to as PTC) characteristics and its manufacturing method. Law. 【Background technique】 [0002] PTC devices have been widely used in temperature detection, safety control, temperature compensation... and so on. In the past, the thermistor device was mainly made of ceramics, but ceramics need to be manufactured at a relatively high temperature. The manufacturing temperature is usually above 900 degrees Celsius, which consumes a lot of energy and the manufacturing process is relatively complicated. Since then, polymer-based thermistor devices have been developed. Due to the polymer-based thermistor device, the manufacturing temperature is below 300 degrees Celsius, which is easier ...

AI Technical Summary

Problems solved by technology

A metal foil, a conductive composite material element with PTC characteristics, and a PTC laminated structure formed by thermocompression of the metal foil have insufficient mechanical strength and are easily warped and deformed in the above-mentioned manufacturing process. After the circuit is made, it is laminated with other PTCs When the structure, insulation reinforcement material or metal layer is thermally bonded to form a multi-layer PTC laminate structure, there will be inaccurate alignment of the upper and lower layers

[0007] And the known prior art is to directly fit carbon black with metal columnar protrusions, and because the geometric shapes of carbon black and metal column protrusions are different, the subsequent density is not ideal.

At the same time, the resin on the surface of carbon black has poor fluidity between carbon black and metal, and can only adhere to the metal surface, which increases the interface impedance and affects its function.

[0008] Then, the metal foil and the conductive composite material element with PTC characteristics are thermally pressed to form a multi-layer PTC laminate structure, and then the plated through hole manufacturing process or the passive component side silver manufacturing process are carried out to form the upper and lower metal layers. The electrical conduction between the layers is used to make a circuit protection device, and the conduction mode between the internal electrodes of the circuit protection device manufactured in this way will be limited

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