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Laser working machine

A technology of laser processing and machine tools, applied in metal processing, stone processing equipment, laser welding equipment, etc., can solve the problem that independent settings are not always effective.

Active Publication Date: 2008-08-06
DISCO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, it is not always effective that the device for forming a protective film on the surface of the workpiece to be processed and the laser processing machine for applying laser light to the workpiece through the protective film are independently installed from the standpoint of the space in the factory and the conveyance of the workpiece between devices.

Method used

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  • Laser working machine
  • Laser working machine
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Experimental program
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Embodiment Construction

[0023] Preferred embodiments of the laser processing machine tool constructed according to the present invention will be described in detail below with reference to the accompanying drawings.

[0024] figure 1 It is a perspective view of a laser processing machine tool constructed according to the present invention. figure 1 The shown laser processing machine comprises a substantially rectangular parallelepiped housing 1 . In this housing 1 set a figure 2 Shown fixed base 2, a chuck workbench unit 3 for holding workpiece, it is installed on the fixed base 2 with the mode that can move in the direction indicated by arrow X, and laser application unit supporting mechanism 4 is perpendicular to The direction indicated by arrow Y in the direction of arrow X is mounted on the fixed base 2 in a movable manner, and a laser application unit 5 is mounted on the laser application unit support mechanism 4 in a manner movable in the direction indicated by arrow Z.

[0025] The above-m...

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PUM

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Abstract

A laser beam processing machine comprising a chuck table for holding a workpiece and a laser beam application means for applying a laser beam to the workpiece held on the chuck table, wherein the machine further comprises a protective film forming means for forming a protective film on the to-be-processed surface of the workpiece before laser beam processing.

Description

technical field [0001] The present invention relates to a laser processing machine tool that performs predetermined processing by applying a laser beam to a predetermined area of ​​a workpiece. Background technique [0002] As known to those of ordinary skill in the art, in the semiconductor device manufacturing process, semiconductor chips are manufactured by dicing a substantially disk-shaped semiconductor wafer, which is composed of a number of grid-shaped blocks (cutting lines) on its surface. segmented areas, and circuits, such as integrated circuits, large scale integrated circuits or the like, formed in each segmented area along the block. The dicing along the streets of the semiconductor wafer is generally performed by a dicing machine called a "dicer". This dicing machine includes a chuck table for holding a semiconductor wafer as a workpiece, a dicing device for cutting the semiconductor wafer held on the chuck table, and a device for moving the chuck table and th...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K26/18H01L21/304B23K26/10B23K26/40B23K37/047B23K101/40B28D1/22B28D5/00H01L21/301H01L21/78
CPCB28D5/0058B23K37/047B23K26/18B28D1/221B23K26/0853H01L21/78B23K26/0884B23K26/4075B23K2201/40B23K26/422B23K26/40B23K26/702B23K2101/40B23K2103/50
Inventor 关家一马吉川敏行
Owner DISCO CORP