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Lsi package with interface module, transmission line package, and ribbon optical transmission line

An interface module and electrical connection technology, applied in the field of LSI packaging with an interface module, can solve problems such as the enlargement of the pressing mechanism

Inactive Publication Date: 2008-12-24
KK TOSHIBA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0014] Therefore, since the deflection of the transmission line due to the excess length is not properly dealt with, the deflection stress due to the transmission line is applied to the optical interface or the LSI package, and it is easy to increase the size of the pressing mechanism in order to resist the stress. And other issues

Method used

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  • Lsi package with interface module, transmission line package, and ribbon optical transmission line
  • Lsi package with interface module, transmission line package, and ribbon optical transmission line
  • Lsi package with interface module, transmission line package, and ribbon optical transmission line

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0059] figure 1 is a diagram showing a schematic configuration of an LSI package with an interface module according to Embodiment 1 of the present invention, Figure 2A and Figure 2B It is an enlarged view of the connecting portion of the high-speed signal wiring according to Embodiment 1 of the present invention, image 3 It is a figure showing the mounting process of the LSI package with an interface module in Embodiment 1 of the present invention, Figure 4 is a diagram showing a schematic configuration of another LSI package with an interface module according to Embodiment 1 of the present invention.

[0060] figure 1 1 in is an LSI package with an interface module, and the interface module 1 has a signal processing LSI2. The signal processing LSI 2 is mounted on the interposer 3 , and the signal processing LSI 2 is electrically connected to the interposer 3 .

[0061] High-speed signal wiring 4 is wired on the interposer 3 , and the high-speed signal wiring 4 is e...

Embodiment 2

[0072] Figure 5 is a diagram showing a schematic configuration of an LSI package with an interface module according to Embodiment 2 of the present invention, Figure 6 It is a figure which shows the connection process of the optical interface module of Example 2 of this invention, Figure 7 It shows the top view of the interposer board with FPC according to the second embodiment of the present invention. Additionally, with figure 1 The same reference numerals are attached to the same parts, and detailed description thereof will be omitted.

[0073] like Figure 5 As shown, an FPC connector 31 (electrical connector) is mounted on the interposer 3 , and an FPC connector 32 (electrical connector) is mounted on the optical interface module 7 . The two ends of FPC 9 are respectively connected with FPC connectors 31, 32, and the electrical connection terminals (not shown) of the interposer 3 of FPC connectors 31, 32 and the electrical connection terminals (not shown) of the op...

Embodiment 3

[0079] Figure 8 is a diagram showing a schematic configuration of an LSI package with an interface module according to Embodiment 3 of the present invention, Figure 9 It is an enlarged view of the connecting portion of the wiring for high-speed signal in Embodiment 3 of the present invention, Figure 10 It is a figure which shows the connection process of the optical interface module of Example 3 of this invention. Additionally, with figure 1 The same reference numerals are attached to the same parts, and detailed description thereof will be omitted.

[0080] like Figure 8 As shown, in this embodiment, the interposer board 3 is connected to the socket 42 connected to the mounting board 6 by solder bumps 41 by input and output pins 43 (terminal pins for socket connection). Specifically, a socket 44 is formed on the socket 42 to fit the input and output pins 43 , so that the inner board 3 is connected to the socket 42 by fitting the input and output pins 43 to the socket...

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Abstract

One embodiment of the present invention provides an LSI package with an interface module, which is characterized in that it includes: an interposer board equipped with a signal processing LSI and having electrical terminals for mounting board connection; The transmission line of the external wiring and the interface module of the socket connection electrical terminal corresponding to the socket for the connection of the installation board; wherein, the above-mentioned interposer board and the above-mentioned interface module respectively have at least any one of the ring electrode and the flat electrode; the above-mentioned interposer board and the above-mentioned interface module are electrically connected by using at least any one of the above-mentioned ring electrode and the above-mentioned plate electrode to perform inductive coupling, electrostatic coupling, and their composite coupling.

Description

[0001] This application is based upon and claims the benefit of priority from prior Japanese Patent Application Nos. 2004-237722 and 2004-237723 filed on August 17, 2004, the entire contents of which are incorporated herein by reference. technical field [0002] The present invention relates to an LSI package with an interface module provided with an interface module for externally wiring a high-speed signal, a transmission line mounting body suitable for mounting a high-speed LSI, and a strip optical transmission line. Background technique [0003] In recent years, the clock frequency of LSIs has been increasing day by day, and CPUs for personal computers have realized clock frequencies of GHz or higher. However, compared with the increase of the clock frequency, the pace of improvement of the throughput of the interface between LSIs is relatively slow, which becomes an obstacle to the performance of the personal computer. For this reason, research and development of high-p...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L25/00H01L23/488H01L31/12G02B6/42
CPCH01L2924/0002H01L2924/15174H01L2924/15192H01L2924/15311H01L2924/00
Inventor 滨崎浩史古山英人沼田英夫田窪知章
Owner KK TOSHIBA