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The encapsulation structure of the optical component semiconductor and its encapsulation method

A packaging method and packaging structure technology, which can be used in semiconductor devices, semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, etc., and can solve problems such as limited application fields

Active Publication Date: 2009-01-14
ADVANCED SEMICON ENG INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this way, a packaging structure without bumps can be formed. However, if the chip 20 is an optical component, its active surface must be able to receive a light source. Therefore, the technology disclosed in this patent is not suitable for packaging optical components, and its application fields are limited.

Method used

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  • The encapsulation structure of the optical component semiconductor and its encapsulation method
  • The encapsulation structure of the optical component semiconductor and its encapsulation method
  • The encapsulation structure of the optical component semiconductor and its encapsulation method

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Embodiment Construction

[0012] Please refer to Figure 5 , which is a flow chart of a preferred embodiment of the packaging method of the semiconductor packaging structure with optical components of the present invention. Please also refer to Figures 6 to 23, which correspond to the Figure 5 Schematic diagram of the structure of each step.

[0013] Firstly, step S101 provides a wafer 30 having an active surface 301 , a back surface 302 and several dicing lines 305 . The active surface 301 has an optical component 303 and at least one upper pad 304 , wherein the optical component 303 , such as a Complementary Metal-Oxide Semiconductor (CMOS), is electrically connected to the upper pad 304 . The dicing lines 305 define a number of chips 306 , as shown in FIG. 6 .

[0014] Next, step S102 forms a dielectric layer (dielectric layer) 31 on the active surface 301 of the wafer 30 , as shown in FIG. 7 . The reason for forming the dielectric layer 31 is to facilitate the subsequent metal layer to be form...

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Abstract

This invention provides one semiconductor sealing structure with optical elements and its sealing method, wherein, the sealing structure comprises one chip, one metal distribution circuit, one transparent insulation layer and one metal reset circuit, wherein, the crystal circle has one main surface, one back surface, at least one pass hole, one optical part and at least one top weld pad; the metal reset circuit is on crystal circle main surface to connect weld pad and metal column; the transparent insulation layer is on main surface of the crystal circle.

Description

【Technical field】 [0001] The present invention relates to a semiconductor packaging structure and a packaging method thereof, in particular to a semiconductor packaging structure with optical components and a packaging method thereof. 【Background technique】 [0002] Please refer to figure 1 and figure 2 , which shows the packaging structure and packaging method disclosed in US Pat. No. 6,040,235. The packaging method of the packaging structure 10 is as follows. Firstly, an insulating material 11 is attached to the active surface of a wafer. Next, the wafer is cut into several dies 12 , and the bonding pads 13 on the active surface of the dies 12 are exposed. Then, after forming two insulating layers 14 and 15 on the lower surface of the crystal grains 12, several electrical contacts 16 are formed, one end of these electrical contacts 16 is connected to the pad 13, and it is along the side of the insulating material 11. The surface 111 extends to the upper surface 112 of...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/50H01L23/485H01L23/28
CPCH01L24/19H01L2224/19H01L2924/00012
Inventor 冯耀信
Owner ADVANCED SEMICON ENG INC