Electronic device for the embedded semiconductor encapsulation part

Abstract

The invention is concerned with the embedding semiconductor packaging electron device, it includes: the printing circuit board with the holding space and the complex number of inner connecting ends on the inside wall of the space; and the semiconductor sealed packaging embeds into the holding space, which includes the wafer carrier, the wafer, the sealed colloid, and the complex number of electricity guiding balls of the side of the wafer carrier attach with the inner connecting ends, as well as keep the holding spaces are unfulfilled by the semiconductor sealed packaging. The invention can improve the limited embedding deepness of the semiconductor sealed packaging to connect the printing circuit board and remain slice shape, which protects the packaging piece and resolves the problems of losing electricity guiding ball for bumping and repairing difficulties. It's also good at heat losing practically.

Description

technical field [0001] The invention relates to an electronic device with a semiconductor package, in particular to an electronic device embedded with a semiconductor package. Background technique [0002] Electronic devices such as memory cards, storage (storage means storage media, storage, internal memory, etc., hereinafter referred to as storage) modules, mobile phone communication boards, computer (or notebook computer) motherboards or display cards are all oriented towards high performance. , Miniaturization and thinning development. However, factors such as the feasibility, cost, high-quality product rate and repairability of its manufacturing still need to be considered in the development process. [0003] In conventional electronic devices, at least one semiconductor package is surface-bonded. Please refer to FIG. 1 , which is a schematic cross-sectional view of a conventional electronic device surface-bonded with a ball grid array package (BGA). The conventional ...

AI Technical Summary

Problems solved by technology

However, the chip 220 used in this electronic device 200 must be a known good die (KGD) and there must be no mistakes in the module process, otherwise a high defect rate will occur, and the defective chip 220 cannot be disassembled and repaired

[0005] This shows, above-mentioned existing electronic device obviously still has inconvenience and defect in structure and use, and urgently needs to be further improved

In order to solve the above-mentioned problems, the relevant manufacturers have tried their best to find a solution, but for a long time no suitable design has been developed, and the general products do not have a suitable structure to solve the above-mentioned problems. This is obviously a problem. Issues that relevant industry players are eager to solve

Images