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Apparatus and method for manufacturing photosensitive laminate

A technology of photosensitive layers and stacks, applied in chemical instruments and methods, printed circuit manufacturing, lamination, etc., to achieve the effects of efficient production, effective high quality, simple process and layout

Inactive Publication Date: 2009-08-19
FUJIFILM CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, it is impossible to precisely position the laminated film 1a and the substrate 11 with respect to the laminating rollers 12a, 12b.

Method used

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  • Apparatus and method for manufacturing photosensitive laminate
  • Apparatus and method for manufacturing photosensitive laminate
  • Apparatus and method for manufacturing photosensitive laminate

Examples

Experimental program
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Embodiment Construction

[0052] figure 1 An apparatus 20 for manufacturing a photosensitive laminate according to a first embodiment of the present invention is shown in a schematic side view. The manufacturing apparatus 20 operates to thermally transfer the photosensitive material layer 28 (described later) of the elongated photosensitive web 22 to the glass substrate 24 during the manufacture of liquid crystal or organic EL color filters.

[0053] figure 2 The photosensitive connection board 22 used in the manufacturing apparatus 20 is shown in cross section. The photosensitive connecting plate 22 includes a laminated assembly of a flexible base film (support) 26 , a photosensitive material layer (photosensitive resin layer) 28 disposed on the flexible base film 26 ; and a protective film 30 disposed on the photosensitive material layer 28 .

[0054] Such as figure 1 As shown, the manufacturing device 20 includes: a roll-out mechanism 32, which is used to accommodate a photosensitive web roll ...

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PUM

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Abstract

A manufacturing apparatus (20) having: a unwinding mechanism (32); a handling mechanism (36); a label bonding mechanism (40); a storage mechanism (42); a peeling mechanism (44); a substrate feeding mechanism (45); and binding mechanism (46). A detecting mechanism (47) for directly detecting the photosensitive connecting plate (22) is arranged upstream of the bonding mechanism (46) and close to the bonding mechanism (46). Based on the detection information from the detection mechanism (47), the relative positions of the substrate (24) in the boundary position and the bonding position are adjusted.

Description

technical field [0001] The present invention relates to the production of a photosensitive laminated body by conveying an elongated photosensitive web comprising a photosensitive material layer and a protective film sequentially stacked on a support, peeling off the protective film to expose the sensitive material layer, and bonding the exposed photosensitive material layer to a substrate Apparatus and methods. Background technique [0002] For example, substrates for liquid crystal panels, substrates for printed wiring boards, and substrates for PDPs (plasma display panels) have a photosensitive sheet (photosensitive connection board) with a layer of photosensitive material (photosensitive resin) bonded to the surface of the substrate. ). The photosensitive sheet includes a layer of photosensitive material and a protective film sequentially placed on a flexible plastic support. [0003] An applying apparatus for applying such a photosensitive sheet is generally operated t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B38/18H05K3/00
Inventor 末原和芳秋好宽和伊本贤一森亮铃木智明杉原了一
Owner FUJIFILM CORP