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Surfacial assembler

A technology of surface mounting machine and camera device, which is applied in the direction of conveyor objects, transportation and packaging, electrical components, etc., which can solve problems such as poor installation performance, longer moving distance, and damage to suction nozzles, so as to avoid mutual interference , Inhibition of damage to the suction nozzle and the effect of shortening the moving distance

Active Publication Date: 2009-08-19
YAMAHA MOTOR CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, in the electronic component mounting machine of the above-mentioned Patent Document 1, as the sensor is fixedly mounted on its main body, the detection position on the main body is limited, so the movement of the head required for detection is made according to the current position of the head. The longer the distance, the longer the time required to move the head, and as a result, the workability of the installation work is often deteriorated.
[0006] Therefore, it is also considered to install a plurality of sensors on the main body, but in this case, the proportion of the area occupied by the sensor on the main body increases, and the area of ​​the main body needs to be enlarged accordingly, so the area of ​​the mounting machine itself is enlarged.
[0007] Moreover, in the electronic component mounting machine of Patent Document 1, since the sensor is arranged on the return path (moving path) of the head, if an erroneous operation of the head occurs, the suction nozzle may collide with the sensor and the sensor may be damaged. Damaged nozzle

Method used

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Embodiment Construction

[0032] Hereinafter, best embodiments of the present invention will be described with reference to the accompanying drawings.

[0033] figure 1 is a partial plan view of the surface mounting machine of the present invention, figure 2 is omitted figure 1 A side cutaway view of part of the surface mount machine shown, image 3 is omitted figure 1 Front cutaway view of part of the surface mount machine shown.

[0034] The surface mounting machine mainly includes: the main mechanism part that mounts electronic components C (small chip components such as ICs, transistors, capacitors, etc.: refer to Fig. 9(a)) on the printed circuit board P by the operation of various parts of the mechanism 1; and a controller (control device) 30 (refer to Figure 4 ).

[0035] The main body mechanism unit 1 has a mounter body composed of a base 2 and the like, and a head unit (nozzle holding member) 3 movable relative to the mounter body.

[0036] On the above-mentioned base 2, there is prov...

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Abstract

The present invention is a miniaturized surface mounter capable of suppressing damage to a suction nozzle and performing carry-back detection of the suction nozzle at high speed. In this surface mounting machine, the head unit (3) with the suction nozzle for absorbing the electronic component (C) is relatively displaced relative to the base (2) on which the printed circuit board (P) is loaded, thereby absorbing the electronic component (C) on the suction nozzle. The electronic components (C) on the board are installed on the printed circuit board (P), which includes the head unit (3) supported on the base (2) in a form that allows the head unit (3) to displace freely along the X axis The support member (10) on the top; the side camera that is arranged on at least one of the head unit (3) and the support member (10) and can take pictures of the suction nozzle from the side; after performing the electronic component detachment operation, . A controller for judging whether the component is attracted to the lower end of the suction nozzle based on the side image of the electronic component (C).

Description

technical field [0001] The present invention relates to a surface mounter for mounting electronic components such as IC chips on a printed wiring board. Background technique [0002] A generally known surface mounter is a surface mounter in which the head with a suction nozzle is driven between the electronic component supply unit and the printed circuit board, and the electronic components sucked by the supply unit are transported to the printed circuit board and mounted . [0003] Some of these surface mounters can detect whether electronic components remain (whether the electronic components are brought back) to the suction nozzle where the electronic components should be installed (for example, Patent Document 1: Japanese Patent Laid-Open Publication No. Hei 11-346100 No. disclosed electronic component mounting machine). [0004] This electronic component mounting machine has a sensor fixedly installed on its main body, and the sensor can detect whether there is a suct...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K13/04H05K13/02B65G47/91
Inventor 山田刚
Owner YAMAHA MOTOR CO LTD
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