A multiple-chip structure and multiple-chip electronic device with multiple-chip structure

Abstract

The multi-chip structure comprises: a first chip, which includes a buffer, an inner connection area, and a first surface; wherein, the buffer and connection area are insulated; and a second chip on surface of the first chip connected to the connection area and buffer with a first and second type signal respectively. This invention is low cost and high yield.

Description

technical field [0001] The invention relates to a multi-chip structure and a multi-chip electronic device with the multi-chip structure, in particular to a multi-chip structure and a multi-chip electronic device which improve the process yield and reduce manufacturing costs. Background technique [0002] In the semiconductor industry, the production of integrated circuits (IC) can be mainly divided into three stages: IC design, IC process, and IC package. [0003] In the fabrication of integrated circuits, chips are completed through wafer fabrication, integrated circuit formation, and wafer sawing. The chip has an active surface, which generally refers to the surface of the chip with active elements. After the integrated circuit inside the wafer is completed, the active surface of the wafer is further equipped with a plurality of bonding pads, so that the chips formed by dicing the wafer can be electrically connected to a carrier outside through these pads ( carrier). Th...

AI Technical Summary

Problems solved by technology

However, the system chip has too many mask processes, the cost is too high, and the yield is too low. Therefore, in actual development, the development of the system chip still has a lot of obstacles

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