Air-drying unit in air-drying machine
An air dryer and air drying technology, applied in air conditioning systems, space heating and ventilation, heating methods, etc., can solve the problems of many parts, high cost, large volume, etc., and achieve the effect of fewer parts and low cost
Inactive Publication Date: 2009-09-16
BOSSMEN
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Problems solved by technology
[0002] Taiwan has an island-type climate, and there will be a lot of water in the air, plus a small amount of impurities such as oil and dust, which will cause a considerable degree of defect rate when the wafer is made into an integrated circuit
[0003] In order to solve the above problems, there are currently two solutions. The first is to inject compressed air into a container filled with desiccant through the intake pipeline. The moisture in the compressed air is squeezed into the desiccant, and the dry air passes The gas pipeline enters the airtight cabinet, and when the desiccant is saturated with water, the solenoid valve closes the air inlet / outlet pipeline, opens the pressure relief valve, and instantly takes away the saturated water of the desiccant, so that the desiccant can be used as dry air again, but This kind of practice is for general industrial use, with large volume, many parts, complex control circuit and high cost, and the speed of drying air is slow, so it is not used in general fabs.
[0004] The second is to continuously inject nitrogen gas into the airtight cabinet where the wafer is placed, commonly known as nitrogen cabinet, to squeeze out the air with moisture in the original cabinet. It is used in general fabs, but it also has the disadvantage of high cost. the need to improve
Method used
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Embodiment Construction
[0037] The present invention is an air drying device for an air dryer such as Figure 1 to Figure 4 Shown in, the air drying device used in the present invention is used in an air dryer, including:
[0038] Pressurization / pressure relief circulation device, which has a set of parallel hollow cylindrical first and second pipe bodies 10 / 20, the lower and upper sides of the first and second pipe bodies 10 / 20 are respectively provided with hemispherical The filter elements 11 / 12, wherein the directions of a group of relative filter elements 11 / 12 are opposite to each other, and between a group of relative filter elements 11 / 12 are provided with a plurality of desiccant 30 such as Figure 5 ;
[0039] The three-way valve 40 is arranged on the lower side of the first and second pipe bodies 10 / 20. The three-way valve 40 is provided with an air inlet pipe 41 and communicates with the inside of the three-way valve 40. The three-way valve 40 has a channel 42 which can be connected to t...
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The present invention relates to an air drying device of an air dryer. The present invention uses a pressurization / pressure release cycle device so that the first pipe body filled with desiccant can be pressurized to produce dry air for a period of time. Make the dry air output for the closed cabinet where the wafer is placed in the fab, release the pressure so that the valve connected to the two tubes filled with desiccant is closed before the internal space of the second tube is pressurized, and then another tube filled with desiccant is opened The second pipe body of the agent is pressurized, and the dry air can be output to be used in the airtight cabinet where the wafer is placed in the fab. Equal, when the internal space of the second tube is depressurized, the first tube is pressurized, and the first and second tubes are used alternately, and the dry air can be continuously transported to the airtight cabinet where the wafer is placed for use. , can achieve the purpose of less parts and low cost.
Description
technical field [0001] The invention relates to an air drying device of an air dryer, which is used to dry the air, and then output the air drying device to a closed cabinet for placing wafers and a general moisture-proof cabinet. Background technique [0002] Taiwan has an island-type climate, and there is a lot of moisture in the air, plus a small amount of impurities such as oil and dust, which will cause a considerable degree of defect rate when wafers are made into integrated circuits. [0003] In order to solve the above problems, there are currently two solutions. The first is to inject compressed air into a container filled with desiccant through the intake pipeline. The moisture in the compressed air is squeezed into the desiccant, and the dry air passes The gas pipeline enters the airtight cabinet, and when the desiccant is saturated with water, the solenoid valve closes the air inlet / outlet pipeline, opens the pressure relief valve, and instantly takes away the sa...
Claims
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IPC IPC(8): B01D53/26F24F3/14
Inventor 吴进明
Owner BOSSMEN