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Electronic component mounting method, and circuit board and circuit board unit used therein

A technology of electronic components and mounting methods, which is applied to the field of circuit boards and circuit board units for mounting electronic components, and can solve the problem of inability to ensure joint reliability, inability to absorb electrode height deviation, and lack of joint between electrodes 26a and electrode welding areas 22 And other issues

Inactive Publication Date: 2009-09-16
PANASONIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When remelting is performed in this state, the electrode height deviation cannot be absorbed, such as Figure 11E As shown, the electrode 26a and the electrode pad 22 have not been bonded, and there is a problem of poor mounting quality such as non-bonding.
[0030] Moreover, although the solderless underfill mounting method melts the electrode 26a formed by the solder ball itself, and welds the electrode 26a of the CSP 26 to the electrode pad 22 of the circuit board 21, the solder amount of the electrode 26a is extremely small, and the joint strength after soldering Very low, there is a problem that even if the reinforcement is reinforced with the reinforcement resin 34, the joint reliability cannot be ensured
[0031] Furthermore, it is necessary to form the electrode 26a of the CSP 26 with solder balls that are heated and melted in the remelting process, and there is a problem that the CSP 26 that forms the electrode 6a with copper beads, brass beads, and high-temperature solder beads that are not melted in the remelting process can not be mounted.

Method used

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  • Electronic component mounting method, and circuit board and circuit board unit used therein
  • Electronic component mounting method, and circuit board and circuit board unit used therein
  • Electronic component mounting method, and circuit board and circuit board unit used therein

Examples

Experimental program
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Embodiment approach 1

[0060] Figure 1A ~ Figure 1E It is a process diagram of the electronic component mounting method in Embodiment 1 of this invention. In this embodiment, a chip component 6 (sometimes only referred to as an electronic component 6) with a size of 1.0 mm×0.5 mm is installed on the circuit board 1, and a WL-CSP (Wafer-Level CSP) 5 (sometimes It is only recorded as the method of electronic parts 5). Figure 1A Among them, the circuit board 1 is made of, for example, glass epoxy resin, and has gold-plated electrode pads 2 for bonding. In the subsequent process, such as Figure 1B As shown, an uncured resin sheet 3 is disposed on a circuit board 1 . A thermosetting resin sheet with a thickness of 30 μm is used as the resin sheet 3 , which is cut out to have the same overall size as the circuit board 1 , mounted and arranged on the circuit board 1 . The size of the resin sheet 3 can also be cut according to the area where the junction between the circuit board 1 and the electronic...

Embodiment approach 2

[0068] Next, Embodiment 2 of the present invention will be described. In the following description of the embodiments, the same reference numerals are assigned to the same components as those in the preceding embodiments, and descriptions thereof will be omitted, and differences will be mainly described.

[0069] In Embodiment 1 described above, a thermosetting resin sheet is used as the resin sheet 3 , but in this embodiment, a thermoplastic resin sheet is used as the resin sheet 3 . Even when the thermoplastic resin sheet is used in this way, the same bonding portion reinforcement effect can be obtained.

Embodiment approach 3

[0071] Next, refer to image 3 Embodiment 3 of the present invention will be described. In the present embodiment, pores 10 having a pore diameter of, for example, 50 micrometers are formed in a matrix at a constant interval of 50 micrometers over substantially the entire surface of the resin sheet 3 . The diameter of the pores 10 can be appropriately selected from a range of several micrometers substantially corresponding to the solder particles of the solder paste 4 to a diameter corresponding to the size of the electrode pad 2 .

[0072] In the present embodiment as well, the electronic components 5 and 6 can be soldered together in the same steps as in the first embodiment, and the joint portion can be reinforced together. The pores 10 are formed at constant intervals on the resin sheet 3 , and in the heating zone of a few seconds to about 350 seconds in the remelting process, when the resin sheet 3 is softened, the melted solder penetrates the softened resin sheet 3 thro...

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PUM

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Abstract

A method for mounting electronic components, comprising arranging unhardened reinforcing resin (3, 15) on a circuit board (1) in a step-by-step process, and bonding electrodes (5a, 6a) of electronic components (5, 6) to the circuit board ( 1) The process of disposing solder paste (4) on the joint portion, the process of mounting electronic components (5, 6) on the circuit board (1), and disposing the reinforcing resin (3, 15) and solder paste (4) and the circuit board (1) on which the electronic components (5, 6) are mounted is heated and then cooled. With this method, it is possible to mount with high bonding reliability, and at the same time, the conventional surface mounting process can be applied as it is, and it can cope with the miniaturization and pitch reduction of electronic components without reducing productivity and mounting quality.

Description

technical field [0001] The present invention relates to a method for mounting electronic components, and more particularly to a method for mounting electronic components in which a junction between a circuit board and electronic components is reinforced with resin, and to a circuit board used in the method for mounting electronic components and a circuit board for mounting electronic components unit. Background technique [0002] Surface mount technology is generally known as a method of mounting electronic components on a circuit board by soldering. This surface mounting process will be described, and each process performed is as follows: [0003] (1) Solder paste printing process, [0004] Print solder paste as a bonding material on the electrode pads of the circuit board; [0005] (2) Electronic component loading process, [0006] The electronic components are loaded into the electrodes of the electronic components and arranged on the solder paste printed on the elect...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/34
Inventor 森将人大西浩昭平野正人西田一人
Owner PANASONIC CORP