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Apparatus and method for reducing contamination in immersion lithography

An immersion, photolithography technology, used in photolithography process exposure devices, microlithography exposure equipment, optics, etc.

Inactive Publication Date: 2009-09-23
INT BUSINESS MASCH CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The presence of residual liquid layers or droplets can easily lead to the formation of defects

Method used

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  • Apparatus and method for reducing contamination in immersion lithography
  • Apparatus and method for reducing contamination in immersion lithography
  • Apparatus and method for reducing contamination in immersion lithography

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Embodiment Construction

[0021] Disclosed herein are devices and methods for reducing contamination associated with immersion lights. Generally, wafer contamination remains near the wafer edge, in the sense that such contamination is produced as a result of the immersion liquid interacting with the topography between the wafer edge and the chuck. Recent simulations have shown that reducing the profile on the surface covered by the tool nozzle helps to maintain the meniscus and helps to avoid the formation of air bubbles. Therefore, it is advantageous to artificially extend the wafer surface so that the transition between wafer and chuck is as flat as possible rather than abrupt.

[0022] As highlighted in detail hereinafter, the exemplary embodiments herein maintain the integrity of the liquid meniscus in the cross-sectional gap of the wafer chuck by introducing an internal liquid circulation path within the chuck. The circulation path includes the slit itself so that the immersion liquid flows radia...

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Abstract

An apparatus for reducing contamination in immersion lithography includes a wafer chuck assembly having a chuck wafer configured to hold a semiconductor wafer on a support surface thereof. There is a slot in the wafer chuck adjacent the outer edge of the wafer and the slot contains a volume of immersion lithography fluid. Fluid circulation paths are configured in the wafer chuck to facilitate outward radiating movement of the immersion lithography fluid in the gap, thereby maintaining the meniscus of the immersion lithography fluid at a selected position relative to the upper surface of the semiconductor wafer. high.

Description

technical field [0001] The present invention relates generally to semiconductor device fabrication and, more particularly, to apparatus and methods for reducing contamination in immersion lithography. Background technique [0002] Photolithography is one of the most important techniques utilized in semiconductor manufacturing, preferably for defining patterns, eg as used in wiring layer patterning processes or doped region definition processes. The photolithography process generally includes an exposure step and a development step, wherein the exposure step utilizes a light source to directly irradiate the photoresist layer or pass through a photomask to cause a chemical reaction in the exposed portion. A development step is performed to remove the exposed portions in the positive resist (or the unexposed portions in the negative resist) and form a photoresist pattern, thereby completing the transfer of the photomask pattern or dummy pattern to the resist material . [000...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/20H01L21/027H01L21/68H01L21/683
CPCG03F7/70341G03F7/70916G03F7/70716G03D3/02H01L21/68735
Inventor D·施奈德黎家辉R·J·贝扎马D·L·戈德法布
Owner INT BUSINESS MASCH CORP