Sheet adhering apparatus

Abstract

A sheet sticking device, comprising: a sheet guide unit (12) including a peeling plate (22) for peeling an adhesive sheet (S) from a peeling sheet (PS); and pressing and pasting the adhesive sheet (S) to the pressure rollers (14) on the wafer (W) supported on the table (13). The peeling plate (22) is supported by air cylinders (50) so as to be able to advance and retreat. According to the size of the wafer (W) or the size of the table supporting it, the peeling plate (22) can be adjusted forward and backward in the initial position of the front end.

Description

technical field [0001] The present invention relates to a sheet sticking device, and more specifically, to a sheet sticking device which can prevent the waste of the sheet when sticking the chip to a plate-shaped member such as a semiconductor wafer. Background technique [0002] Traditionally, on a semiconductor wafer (hereinafter referred to as "wafer"), a protective sheet for protecting the circuit surface is generally pasted, or an adhesive sheet for chip soldering is pasted on the back thereof. [0003] There is known such a sheet sticking device (for example, refer to Patent Document 1): use a kind of roll paper (raw material sheet) that is temporarily stuck with a tape-shaped adhesive sheet on a tape-shaped release sheet, After the tab is peeled and attached to the wafer, it is cut along the periphery of the wafer. [0004] Patent Document 1 Japanese Patent Laid-Open No. 2004-47976 [0005] However, in the sheet bonding apparatus disclosed in Patent Document 1, sinc...

AI Technical Summary

Problems solved by technology

Therefore, in an extremely thin plate-shaped member that is ground into a wafer, which is only tens of microns, if a thin sheet leaving traces of recesses is used, the thickness will be uneven, and the wafer will be easily broken during grinding, so the recessed area cannot be used as a chip. paste chip

Therefore, although it is sufficient to convey the sheet so as not to include the above-mentioned concave region, it is not suitable because the sheet will be consumed for no reason.

[0006] Such an unreasonable phenomenon can be solved by setting the guide rollers 28 groups at positions very close to the outer edge of the wafer, but it cannot correspond to the occasion of changing the size of the table according to the size of the wafer. The waste of flakes cannot be avoided

[0007] In addition, the above-mentioned unsuitable phenomenon caused by the traces of the rib-like recesses also occurs when the peeling sheet is used.

Images