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Apparatus and methods for continuously depositing a pattern of material onto a substrate

A substrate and pattern technology, applied in metal material coating process, conductive pattern formation, vacuum evaporation plating, etc., can solve problems such as inability to achieve productivity

Inactive Publication Date: 2010-03-24
3M INNOVATIVE PROPERTIES CO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Therefore the step-and-repeat process cannot achieve the desired productivity

Method used

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  • Apparatus and methods for continuously depositing a pattern of material onto a substrate
  • Apparatus and methods for continuously depositing a pattern of material onto a substrate
  • Apparatus and methods for continuously depositing a pattern of material onto a substrate

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Embodiment Construction

[0024] Embodiments of the present invention provide continuous material deposition on a substrate in a pattern defined by a mask. The continuous deposition is provided by continuously moving the substrate and mask through the deposition zone provided by the deposition sources and cylinders.

[0025] figure 1 An illustrative embodiment of an apparatus and resulting method forming one stage for successively depositing a pattern of material on a substrate is shown. In this particular embodiment, this first stage is used to deposit pattern elements called fiducials on the substrate 100, where these fiducials can then be used in subsequent stages to correctly align the substrate with subsequent stage masks. standard, where as referenced below Figure 4 As discussed, this alignment accuracy is on the order of microns. Such fiducials are applied by means of depositing material through a mask 101 comprising holes providing a pattern of fiducials. In addition to the fiducial, it is...

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Abstract

A pattern of material is continuously deposited onto a substrate. The substrate and a mask are continuously brought together over a portion of a drum where a deposition source emits material. The maskincludes apertures that form a pattern, and the material from the deposition source passes through the pattern of the mask and collects onto the substrate to form the pattern of material. The elongation and the transverse position of the substrate and the mask may be controlled. Pattern elements of the substrate and of the mask may be sensed in order to adjust the elongation and / or the transverseposition of the substrate and / or mask to maintain a precise registration. Furthermore, the apertures may have a least dimension on the order of 100 microns or less to thereby create features on the substrate having least dimensions on the order of 100 microns or less.

Description

technical field [0001] The present invention relates to depositing patterns of material onto substrates. More specifically, the present invention relates to depositing patterns of material by means of continuously moving a substrate and a mask defining the pattern across a deposition zone. Background technique [0002] A pattern of material can be formed on a substrate by discharging material from a deposition source in a direction towards the substrate. By placing a mask between the deposition source and the substrate, the material is deposited on the substrate in a specific pattern. The mask includes holes defining a pattern, and only deposition material passing through the holes reaches the substrate so that the material is deposited in the pattern. [0003] Such patterns can be deposited on the substrate for various purposes. As an example, a circuit pattern can be formed on a substrate by depositing material in various patterns. For example, conductive traces like m...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/12B41F15/08
CPCH05K1/0393H05K2203/1545B41P2215/12B41F15/0836C23C14/042H05K3/143H05K2203/0134C23C14/562
Inventor 唐纳德·J·穆克卢尔杰弗里·H·托其丹尼尔·H·卡尔森詹姆斯·N·多布斯约翰·T·斯特兰德罗纳德·P·斯万松
Owner 3M INNOVATIVE PROPERTIES CO
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