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Camera module and its manufacture

A technology of cameras and bumps, which is applied in the direction of cameras, camera bodies, telephone structures, etc., and can solve the problems of increasing the cost of camera modules, increasing the size of devices, etc.

Inactive Publication Date: 2010-05-12
TERRASUN LLC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] Therefore, there are caused problems of increasing the cost of the camera module, and since it is necessary to provide multi-directional photography using a plurality of camera modules, the size of the device is increased, etc.

Method used

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  • Camera module and its manufacture
  • Camera module and its manufacture
  • Camera module and its manufacture

Examples

Experimental program
Comparison scheme
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Embodiment Construction

[0025] The present invention will now be described in detail in conjunction with specific embodiments with reference to the accompanying drawings.

[0026] image 3 is a cross-sectional view of a camera module according to one embodiment of the present invention.

[0027] see image 3 , the respective backsides are provided with first and second camera sensor chips 112a, 112b bonded with a non-conductive adhesive 116 so that the camera area parts made of microlenses face in opposite directions.

[0028] For example, any first camera sensor chip 112a of the above-mentioned first and second camera sensor chips 112a, 112b is connected to an electrical signal through a signal connection bump 114a, while the other second camera sensor chip 112b is connected to an electrical signal through a signal connection bump 114a. The wire 114b connects electrical signals and is mounted on the substrate 120 .

[0029] A through hole 122 is formed in the substrate 120 , located below the mou...

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PUM

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Abstract

A camera module consists of the first and the second shooting inductor chips bound on each back surface of shooting region, base plate connected to the first shooting inductor chip through lug and tothe second shooting indicator chip through metal wire, through hole formed on base plate at position of erection region for the first shooting inductor chip, infrared ray cut-off filter set on said through hole, the first and the second fixing supports set at top and bottom sides of base plate, the first and the second lens set separately on the first and second fixing supports.

Description

technical field [0001] The present invention generally relates to a camera module and its manufacturing method. More specifically, it relates to using one camera module to complete photography in both directions, front and rear, and to make a double-sided camera sensor by sawing two wafers of camera sensors in a bonded state. A camera module and a method for manufacturing the device chip thereby saving production costs. Background technique [0002] Generally, a traditional camera module is a small camera structure installed on a mobile phone. figure 1 is a schematic structure of the camera module. [0003] figure 1 is a cross-sectional view of a conventional camera module. [0004] As shown, a conventional camera module includes a camera sensor chip 12 mounted on a substrate 20 (a printed circuit board or a ceramic substrate). The input and output ends of the above-mentioned camera sensor chip 12 are soldered to the corresponding ends of the above-mentioned substrate 20...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03B17/02H04N5/225H04M1/02
Inventor 李种炫全东锡
Owner TERRASUN LLC