Fixation carrier, production method of fixation carrier, use method of fixation carrier, and substrate reception container

Abstract

An object is to provide a fixing carrier, a fixing carrier manufacturing method, a method of using the fixing carrier and a substrate storage container, which provide proper shipment of items to be loaded that are prone to warp and crack. A base 2 having rigidity is hollowed on its surface and formed with a sectioned space 3 laminated and covered by a supporting layer 8 that supports semiconductor wafer W, multiple projections 4 that are formed in the sectioned space and supports supporting layer 8 in contact therewith and an exhaust passage 6 that is bored through base 2 and draws air out ofsectioned space 3 covered by supporting layer 8. Since semiconductor wafer W that is prone to warp and crack is supported by supporting layer 8 of a fixing carrier 1 and accommodated in the containerbody of a substrate storage container, instead of being kept directly in the container, so it is possible to achieve safe and proper shipment between factories.

Description

technical field [0001] The present invention relates to a fixed carrier for mounted articles composed of substrates represented by semiconductor wafers, quartz glass, etc., printed wiring boards, chip components, and other components that are difficult to hold individually, a method of manufacturing a fixed carrier, and use of a fixed carrier Method and substrate storage container. Background technique [0002] In recent years, the diameter of semiconductor wafers has been expanded from 200mm to 300mm. After the circuit is patterned and formed on the surface of this 300mm type semiconductor wafer, in view of the packaging requirements of the laminated structure, etc., a protective tape for backside grinding is attached to the surface, and The back surface of the back surface is ground and thinned by a back grinding device, then supplied to a slicing process, the protective tape is peeled off, and a slicing tape for the slicing process is attached. [0003] The semiconductor...

AI Technical Summary

Problems solved by technology

[0005] Conventional semiconductor wafers are processed as above, and become very thin by back grinding, and tend to warp and break easily, so there is a big problem that it is difficult to properly transport from the factory to other factories without being damaged.

[0006] As a method to solve this problem, the method of using the above-mentioned dedicated carrier is considered, but this carrier is only a special product used in the transportation in the factory, and it is not a structure that takes into account the harsh transportation conditions, so it cannot be transferred from the factory to the carrier. Used for long-term transportation in factories

[0007] In addition, when the dicing tape is attached to the semiconductor wafer for a long time during transportation from factory to factory, the adhesive of the dicing tape may be transferred to the bumps of the circuit, causing a problem.

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