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Method for collectively producing a superimposed element microstructure

A collective, component technology, applied in the field of collective manufacturing, which can solve problems such as technical complexity

Active Publication Date: 2008-02-13
特励达易图威半导体股份有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, these techniques are complex because they require specific texturing of the two wafers before they are brought into contact

Method used

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  • Method for collectively producing a superimposed element microstructure
  • Method for collectively producing a superimposed element microstructure
  • Method for collectively producing a superimposed element microstructure

Examples

Experimental program
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Embodiment Construction

[0044] The invention will be described in detail for a simple example of an image sensor formed from a silicon chip covered by a transparent glass plate that leaves the contacts on the chip accessible, allowing contact between the chip and the outside of the sensor. electrical connection. However, the present invention is not limited to this specific example.

[0045] The process starts with a semiconductor wafer (in principle a single-crystal silicon wafer) on which an array of identical chips in rows and columns, each corresponding to a corresponding image sensor, is fabricated using conventional deposition and photolithography processes. Subscript n is assigned to the chip in row n of the array, subscript n-1 is assigned to the adjacent chip on one side, and subscript n+1 is assigned to the adjacent chip on the other side. P per chip n Both have an active area ZA n , which includes a matrix of photosensitive elements and associated electronic drivers. Conductive contact...

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Abstract

The invention relates to the collective fabrication of superposed microstructures, such as an integrated circuit and a protective cover. Individual structures each comprising superposed first and second elements are fabricated collectively. The first elements (for example, integrated circuit chips) are prepared on a first plate and the second elements (for example, transparent covers) are prepared on a second plate. The plates are bonded to each other over the major portion of their facing surfaces, but with no bonding of the defined zones in which there is no adhesion. The individual structures are then diced via the top on the one hand and via the bottom on the other hand along different parallel dicing lines passing through the zones with no adhesion, so that, after dicing, the first elements retain surface portions (those lying between the parallel dicing lines) that are not covered by a second element. A connection pad may thus remain accessible at this point.

Description

technical field [0001] The present invention generally relates to the collective fabrication of stacked and bonded microstructures, with particular application to the fabrication of integrated circuits, and is extendable to micromachined structures fabricated using collective processes similar to those used for integrated circuits. These micromachine structures are called MEMS when they combine electrical and mechanical functions (eg pressure microsensors, acceleration microsensors, etc.) and MOEMS when they combine electrical and optical functions (image sensors, displays). Background technique [0002] In order to make the present invention more clearly understood by way of example only, an application to the manufacture of an electronic image sensor will be more precisely described. Electronic image sensors are commonly used, for example, to form the core components of digital cameras. It converts the image projected onto its detection surface into an electronic signal. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/02
CPCH01L27/1462H01L2924/10253H01L2224/48091B81C1/0023H01L2224/45124H01L2224/45144H01L2924/1461H01L2924/00014H01L2924/00H01L23/02
Inventor P·罗默沃B·阿斯帕尔
Owner 特励达易图威半导体股份有限公司