Seat structure of LED

Abstract

The present invention relates to a kind of Light Emitting Diode (LED) base structure, and includes: a heat-dissipated base with a crystal-fixed area; an insulating component has a first side and a second side, in which the first side clings to the heat-dissipated base, and an opening is set on the position of which the insulating component relates to the crystal-fixed area; at least one line frame set on the second side, keeps insulation and a certain distance from the heat-dissipated base by the insulating component; a insulating base covers the heat-dissipated base, the insulating component and the line frame, and forms complete structure of the LED base substrate. The electric connection between the heat-dissipated base and the line frame can be broken by the insulating component; the density and strength of the structure can be added by the cover structure of the insulating base to improve quality and good-production ratio of the LED base substrate structure.

Description

technical field [0001] The present invention relates to a light emitting diode (Light Emitting Diode, LED) base body structure, in particular to a light emitting diode base body structure applied to a high power light emitting diode (high power light emitting diode) lighting unit. Background technique [0002] In recent years, due to the continuous improvement of the luminous efficiency of light emitting diodes, the application market of light emitting diodes has grown significantly. The reason why light-emitting diodes can have such a high market growth rate is that there are two main growth drivers. The first is the application of light-emitting diodes in the backlight market of flat-panel liquid crystal displays. Light-emitting diodes and cold cathode fluorescent lamps (Cold Cathode Fluorescent Lamps, CCFL) The second is the replacement application between light-emitting diodes and incandescent bulbs or fluorescent lamps in the general light source market. Among the grow...

AI Technical Summary

Problems solved by technology

[0008] The object of the present invention is to overcome the defects existing in the existing light-emitting diode base structure, and provide a new type of light-emitting diode base structure. The technical problem to be solved is to improve the light-emitting diode base structure. The opening of the thimble and the gap between the heat dissipation base and the insulating base body will have moisture or moisture infiltration, and the insulating base body is formed first, and then the heat dissipation base and the insulating base body are filled or inserted for combination and assembly , resulting in leakage of liquid epoxy resin or silica gel or poor structural adhesion during packaging operations, resulting in defects in the packaging process of light-emitting diodes, which is more suitable for practical use

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