The present application relates to
chip technology field, specifically a kind of coreless substrate manufacturing method.It is characterized in that: including the following steps: S1,
laser slot is opened on substrate, and
chip is buried in slot;S2, filling
colloid;S3,
laser hole is shot;S4, filling
laser hole, while using 3D printing to print L1 circuit layer;S5, form L2
copper layer;S6, form L2 circuit layer;S7, form L3
copper layer;S8, punch in L3
copper layer;S9, form L3 circuit layer, and connect L1 circuit layer, L2 circuit layer, L3 circuit layer;S10, make solder
resist layer and copper surface opening;S11,
cutting.Compared with prior art, in
chip is placed on the substrate of
organic polymer resin, with the rigidity of organic resin bearing, the yield can be avoided to be influenced because of board warping during manufacturing process.3D printing technology and traditional coreless substrate
manufacturing technology can shorten the manufacturing process of substrate, save cost and substrate manufacturing time, can improve the efficiency of substrate manufacturing.