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Chip packaging body, chip structure and manufacturing method thereof

A technology of chip structure and manufacturing method, which is applied in semiconductor/solid-state device manufacturing, electric solid-state devices, semiconductor devices, etc., can solve problems such as short circuit of gold bumps, abnormal display of liquid crystal display modules, etc., and achieve the effect of optimal reliability

Inactive Publication Date: 2008-04-16
NOVATEK MICROELECTRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the outwardly grown gold is in electrical contact with other bumps, it is easy to cause a short circuit between the gold bumps, which in turn causes abnormal display of the liquid crystal display module.

Method used

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  • Chip packaging body, chip structure and manufacturing method thereof
  • Chip packaging body, chip structure and manufacturing method thereof
  • Chip packaging body, chip structure and manufacturing method thereof

Examples

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Embodiment Construction

[0052] The invention provides a chip structure, which mainly includes an integrated circuit element, a plurality of bumps and at least one spacer. Integrated circuit components have multiple contacts. The bumps are located on the contacts. The spacer is located on the surface of the integrated circuit and between two adjacent bumps, wherein the maximum thickness of the spacer is less than or equal to the thickness of the bump. The fabrication method of the chip structure will be described in detail in the following embodiments.

[0053] Figure 1A ˜FIG. 1F is a schematic flowchart of a method for manufacturing a chip structure according to an embodiment of the present invention. Please refer to Figure 1A, first provide a wafer W. The wafer W has a plurality of integrated circuit elements 110, and each integrated circuit element 110 has a plurality of contacts 112, wherein the material of the contacts 112 is, for example, aluminum or other conductive materials.

[0054] Pl...

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PUM

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Abstract

A chip architecture comprises an IC element, a plurality of convex blocks and at least one interstitial article. The IC element is provided with a plurality of contact points, the plurality of convex blocks are positioned on the contact points, and the interstitial article is positioned on the surface of the IC and between two adjacent convex blocks, wherein, the maximum thickness of the interstitial article is less than or equal to that of the convex blocks. With the configuration of the interstitial article, the invention keeps two adjacent convex blocks in a good state of electric insulation. In addition, the invention further provides the technique of the chip architecture and the chip package with the chip architecture.

Description

technical field [0001] The invention relates to a semiconductor element and a manufacturing method thereof, and in particular to a chip package, a chip structure and a manufacturing method of the chip structure. Background technique [0002] With the continuous evolution of packaging technology, chip-on-film (Chip On Film, COF) bonding technology has become one of the main packaging technologies at present. Generally speaking, the chip-film bonding technology has a wide range of applications. For example, the electrical connection between a liquid crystal panel (liquid crystal panel) and a drive chip (drive IC) is an application of the chip-film bonding technology. [0003] Taking the bonding process of the liquid crystal panel and the driver chip as an example, this technology firstly provides a flexible substrate, wherein a surface of the flexible substrate has a circuit layer, and the circuit layer has a plurality of internal pins. Afterwards, a driver chip is provided, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/82H01L21/60H01L21/28H01L27/02H01L23/485H01L23/488H01L23/50
CPCH01L24/11H01L2224/11H01L2924/14H01L2924/00H01L2924/00012
Inventor 林瑞昌张大鹏
Owner NOVATEK MICROELECTRONICS CORP