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Arrangement for surface mounting an electrical component by soldering, and electrical component for such an arrangement

A surface mount, electrical component technology, applied in the direction of printed circuits connected with non-printed electrical components, assembling printed circuits with electrical components, electrical components, etc., can solve the problem of increasing the total height of components, not suitable for surface mount methods And other issues

Active Publication Date: 2011-07-20
COACTIVE TECHNOLOGIES LLC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0014] A particular drawback of this design is that it increases the overall height of the component and is not suitable for surface mount methods using reflow soldering

Method used

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  • Arrangement for surface mounting an electrical component by soldering, and electrical component for such an arrangement
  • Arrangement for surface mounting an electrical component by soldering, and electrical component for such an arrangement
  • Arrangement for surface mounting an electrical component by soldering, and electrical component for such an arrangement

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Embodiment Construction

[0032] In the following description, the same, same function or similar elements will be denoted by the same reference numerals.

[0033] Not for limitation, but for purposes of easier understanding of the specification and claims, the terms "vertical", "horizontal", "upper or top", "lower or bottom" etc. will be referenced to the longitudinal axis V of the drawings. As used herein, the longitudinal axis V forms part of the orthogonal coordinate system L, V, T shown in the Figures, which are shown by convention only and without reference to the Earth's gravity.

[0034] figure 1 The structure 10 shown consists essentially of a lower printed circuit board 12 and an electrical switch 14 which is an electrical component that can be surface mounted and fastened on the top surface 16 of the board 12 by soldering.

[0035] As is known, the top surface 16 comprises a plurality of electrically conductive connection pads, here four connection pads 18 arranged at the four corners of a ...

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Abstract

The invention provides an arrangement comprising a substrate (12) and an electrical component (14) which comprises a base (20) made of insulating material and connection terminals (40), each of which is connected to a connection pad (18) of the substrate (12) by means of a spot (60) of solder paste, characterized in that it includes a block (62) which is interposed between the substrate (12) and the base (20) of the component, which block is located substantially on the axis (A-A) of application of the force (F) for actuating the component, in order to avoid deformation of the base (20), and consists of a spot of solder paste soldered to an associated conducting pad (64) on the substrate (12). The present invention also provides an application to the mounting of a push-button electrical switch.

Description

technical field [0001] The present invention relates to a structure for surface mounting electrical components on a substrate by soldering, especially by reflow soldering. [0002] The invention also relates to electrical components for structures according to the invention, and in particular to electrical switches. Background technique [0003] The invention relates in particular to structures of the following types, including: [0004] - a substrate, such as a printed circuit board, the top surface of which includes a plurality of conductive connection pads; and [0005] - electrical components comprising: [0006] * a base of insulating material, generally in the form of a plate, defined by a bottom surface extending opposite a portion of the top surface of the base, the element being subjected to an actuation force applied in a direction generally normal to the plane of the base; and [0007] * A plurality of terminals disposed on the periphery of the base, each of wh...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/18H05K3/34H01H13/10
CPCH05K2201/2036H05K2201/09472H05K3/303H05K2201/10053H01H2001/5888H05K2201/09781H05K2201/10931H05K3/341Y02P70/50
Inventor 让-克里斯托夫·维莱恩米歇尔·库尔
Owner COACTIVE TECHNOLOGIES LLC