Semiconductor special-purpose equipment wafer grabbing device

Abstract

The invention provides a wafer gripping device which is the equipment specially used for semiconductor, comprising a wafer gripping plate and a vacuum system which is connected with the wafer gripping plate. The wafer gripping plate is a thin-piece shaped integration structure which is bonded by three layers: a gripping panel, a mainbody core plate and a sealing cover plate; the mainbody core plate is provided with a through trough; the gripping panel is provided with a wafer adsorption hole which is correspondingly communicated with the through trough; the position of the sealing cover plate corresponding to the through trough is provided with a vacuum interface. The wafer gripping plate is a fork-shape or claw-shape; the vacuum interface is arranged on a fork handle or a fork handle; wherein, at least two wafer adsorption holes are arranged on a fork tooth or a claw tooth respectively; at least one wafer adsorption hole is arranged on the common boundary position between the fork tooth or claw tooth and the fork handle or claw handle. The device has low requirement to the surface smoothness of an object article to be gripped, reduces manufacture difficulty, has the advantages of simple structure, convenient application, low cost and energy saving, and can be widely applied to the gripping operation of wafer in the equipment specially used for a semiconductor.

Description

(1) Technical field [0001] The invention relates to a target pick-up device, in particular to a device for automatically picking up semiconductor wafers. (2) Background technology. [0002] The realization of automatic pick-up and placement of wafers and automatic transfer of wafers is the premise of fully automatic processing of semiconductor special equipment. A wafer is a thin and brittle disc, which is placed in a special cassette in the production of fully automatic semiconductor special equipment. The distance between the wafers in the cassette is usually less than 4 millimeters. In order to complete the action of automatically picking and placing the wafers, a thinner wafer grabbing device with certain rigidity is needed. In modern production equipment, common target pick-up devices are: clamping type, electromagnetic adsorption type, vacuum suction cup adsorption type, etc. Among them, the clamping target pick-up device is easy to cause damage to the wafer, the str...

AI Technical Summary

Problems solved by technology

[0003] The object of the present invention is to provide a wafer grabbing device for special equipment for semiconductors, which can solve the problems that wafers are difficult to grab and easily cause wafer damage, and solve the problems of traditional wafer grabbing devices with complex structures and the flatness of the surface of the grabbing target. High requirements, difficult processing of each part, difficult to control technical problems

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