Method for controlling the 'first-to-melt' region in a PCM cell and devices obtained thereof
A technology of central area and memory unit, which is applied in the direction of electrical components, instruments, static memory, etc., and can solve the problems of increasing change and reducing the thickness of phase change film, etc.
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[0018] The process according to the invention is implemented as follows. The geometrically long line elements are first fabricated by depositing a layer of phase change material (PCM) and subsequently patterning this layer (Fig. 3). This layer can be patterned in an hourglass shape similar to the structure shown in FIG. 1 . Alternatively, a hard mask such as a TiW layer can be used to pattern this layer. This hard mask is formed on and patterned over the PCM layer. Next, the patterned hard mask is used to pattern the underlying first PCM layer. As shown in FIG. 3, the width W1 of the first mask used to pattern the PCM layer is critical from a process point of view as it is a controlled minimum dimension.
[0019] In a second step, the material properties of the PCM layer are locally altered using a second mask. The material in this region has increased resistivity compared to the unaltered material without substantially changing the PCM properties of the PCM layer. For th...
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