Semiconductor device and packaging structure therefor
A technology for semiconductors and interconnecting components, which is applied to semiconductor devices, semiconductor/solid-state device components, and electrical solid-state devices, etc., and can solve problems such as exceeding the guaranteed temperature, operating errors of semiconductor devices, and increased housing temperature.
Inactive Publication Date: 2010-06-23
YAMAHA CORP
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Problems solved by technology
[0004] However, when two semiconductor chips having different guaranteed temperatures are mounted on the surface of a single substrate of a semiconductor device, the heat generated by the semiconductor chip with the higher guaranteed temperature is undesirably transferred to the other semiconductor chip with the lower guaranteed temperature. chip, causing the temperature of another semiconductor chip to exceed its guaranteed temperature, thereby causing an operating error in the semiconductor device
[0005] When two semiconductor chips having different guaranteed temperatures are mounted on a single stage, heat transfer occurs between the two semiconductor chips via the stage and the resin mold, whereby the temperature of the case (or package) increases, making the temperature of the semiconductor chip Guaranteed temperatures for normal operation may be exceeded, thereby causing operational errors in semiconductor devices
Method used
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Embodiment Construction
[0043] The present invention will be described in further detail by way of examples with reference to the accompanying drawings.
[0044] 1. The first embodiment
[0045] will refer to Figures 1 to 4 The semiconductor device 1 according to the first embodiment of the present invention will be described in detail.
[0046] Such as figure 1 and 2 As shown, the semiconductor device 1 of the first embodiment is used for a power supply such as a power supply for driving a speaker or a pulse width (PW) modulated power supply, wherein the semiconductor device 1 includes a first semiconductor chip 3 (as an analog chip) and a second semiconductor chip 3 Chip 5 (as a digital chip). That is, the semiconductor device 1 is designed to accommodate both analog circuits and digital circuits.
[0047] The semiconductor device 1 includes two stages 7 and 9 having surfaces 7 a and 9 a for mounting semiconductor chips 3 and 5 , a plurality of pins arranged in surrounding areas of the stages...
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A semiconductor device includes two semiconductor chips having different guarantee temperatures, which are individually mounted on two stages distanced from each other and are sealed with a resin mold. One semiconductor chip includes a heating circuit causing a heating temperature that is higher than the guarantee temperature of another semiconductor chip, and the backside of the stage thereof isexposed externally of the resin mold. This reduces the amount of heat transmitted from one semiconductor chip to another semiconductor chip, thus improving the reliability of the semiconductor device. Alternatively, two semiconductor chips having different heights are mounted on a single stage, wherein one semiconductor chip causing a high heating temperature is lowered in height in comparison with another semiconductor chip, thus increasing the heat-transmission path between the semiconductor chips and thus reducing the heat-dissipation path for dissipating heat of one semiconductor chip to a substrate.
Description
technical field [0001] The present invention relates to a semiconductor device and a package structure for mounting the semiconductor device on a substrate. Background technique [0002] Conventionally, various types of semiconductor devices have been developed and manufactured by various manufacturers. For example, Japanese Laid-Open Publication No. 2000-150725 discloses a structure in which a semiconductor chip is mounted on the surface of a rectangular stage and sealed with a resin mold. In this type of semiconductor device, for the purpose of efficiently dissipating heat generated by the semiconductor chip, the back surface of the stage is exposed to the outside of the resin mold and bonded to the substrate (or circuit board) via solder. [0003] Some conventionally known semiconductor devices having the aforementioned structure may each include two semiconductor chips having different guaranteed temperatures (or operating temperatures) mounted on the surface of a singl...
Claims
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IPC IPC(8): H01L25/00H01L25/18H01L23/13H01L23/31H01L23/367H01L23/495
CPCH01L2224/48137H01L2224/48247
Inventor 白坂健一
Owner YAMAHA CORP