Formaldehyde-free rubber film for synthesizing multilayer solid wood base material

Abstract

The invention discloses zero-formaldehyde glue film used for synthesizing multilayered solid wood base material, which has the technical proposal that the zero-formaldehyde glue film is prepared by the materials with the following weight parts: 80-90 parts of polyethylene, 5-19 parts of EVA260 resin, 0.1-0.5 parts of low molecular weighted PE wax and 0.1-0.5 parts of titanium dioxide. The glue film has the advantages that as the zero-formaldehyde glue film used for synthesizing multilayered solid wood base material is characterized by stable melting point, the qualification rate of the finished products of multilayered solid wood base material is greatly improved, thus laying the foundation for the development of mass industrialization; as the glue layer is characterized by low water content, the stability of the shapes and sizes of the multilayered solid wood base material is greatly strengthened; as the glue film is characterized by strong adhesion and zero formaldehyde, the multilayered solid wood base material is firmer and more environment-friendly.

Description

technical field [0001] The invention relates to a zero-formaldehyde adhesive film, in particular to a zero-formaldehyde adhesive film for synthesizing multi-layer solid wood substrates. Background technique [0002] At present, the adhesives used to synthesize multi-layer solid wood substrates in the market have the following deficiencies: First, the commonly used adhesives are mainly synthetic resins, such as urea-formaldehyde glue, phenolic glue, melamine glue, etc. These adhesives all contain formaldehyde, which is seriously harmful The health of the human body; secondly, the traditional sizing method is to apply liquid adhesive on the dry veneer. There will be sandwich or hollow defects between the boards. In addition, the use of liquid glue will increase the water content of the finished product, that is, the multi-layer solid wood substrate, and will also cause distortion of the multi-layer solid wood substrate. Publication number published by the National Patent Offi...

AI Technical Summary

Problems solved by technology

[0002] At present, the adhesives used to synthesize multi-layer solid wood substrates in the market have the following deficiencies: First, the commonly used adhesives are mainly synthetic resins, such as urea-formaldehyde glue, phenolic glue, melamine glue, etc. These adhesives all contain formaldehyde, which is seriously harmful The health of the human body; secondly, the traditional sizing method is to apply liquid adhesive on the dry veneer. There will be sandwich or hollow defects between the boards. In addition, the use of liquid glue will increase the water content of the finished product, that is, the multi-layer solid wood substrate, and will also cause distortion of the multi-layer solid wood substrate.

Publication number published by the National Patent Office: CN101058199A, application number: 200710028074.6; in the technical solution of the disclosed document, the adhesive used is a hot-melt adhesive film or a thermoplastic film, and this technical solution makes up for the above-mentioned defects. However, there are new deficiencies in itself: due to the instability of the melting point of the hot melt adhesive film or thermoplastic film, in the production process, when the heating device exceeds 200 ° C, not only energy is wasted, but also the plate will be scorched. , carbonization phenomenon; when the temperature is lower than 150°C, the bonding adhesive cannot be completely melted and bonded, which affects the quality of the finished product. Therefore, when the technical solution is implemented, the yield is very low, and large-scale and mass production cannot be formed.