Heat dissipative structure, optical pickup apparatus, and optical recording/reproducing apparatus

Abstract

This invention provides a heat dissipative structure that offers high heat dissipation effect with a simple configuration, an optical pickup apparatus having the same, and an optical recording / reproducing apparatus. A heat-dissipating component (22) is provided for a heat-producing component (20). Heat generated in the heat-producing component (20) can be transferred to the heat-dissipating component (22) and released therefrom. The heat-dissipating component (22) has a heat-dissipating plate (25), whereby a large surface area and high heat dissipation effect is obtained. The heat-dissipating portion (24) having the heat-dissipating plate (25) is disposed in a region including a side opposite from a heat-receiving portion (23) which receives heat from the heat-producing component (20), whereby heat is released at a location as far away from the heat-receiving portion (23) as possible. The heat dissipative structure which offers high heat dissipation effect can be implemented with a simple configuration, and the heat-producing component (20) can be cooled effectively.

Description

technical field [0001] The present invention relates to a heat dissipation structure provided in an optical pickup device, and to an optical pickup device and an optical recording and reproducing device having the heat dissipation structure. Background technique [0002] Currently, an optical pickup device for recording or reproducing digital information such as audio information, character information, and video information on an optical information recording medium such as an optical disc is used. In an optical pickup device, information is recorded by irradiating a light beam emitted from a semiconductor laser onto the recording surface of an optical information recording medium through an objective lens, and the information is reproduced by receiving a reflected light beam of the light beam irradiated on the recording surface by a photodetector. [0003] In order to record or reproduce information at high speed using an optical pickup device, a semiconductor laser with h...

AI Technical Summary

Problems solved by technology

(Japan) Unexamined Patent Publication No. 2005-339737 is also the same as Unexamined Patent Publication No. 2002-25243 (Japan), but this will increase the number of parts, increase the cost and increase the size, and due to the greater load applied to the motor , so the heat generated by the motor offsets the air cooling effect

In the structure of (Japanese) Unexamined Patent Publication No. 2004-273043, the casing has an inclined plate protruding obliquely downward from the installation position of the laser drive circuit, and the cooling is performed by the flow of wind caused by the inclined plate when the casing moves horizontally. The laser drive circuit, however, cannot achieve sufficient heat dissipation, especially the air cooling effect during the most important long-term information writing process.

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