Chuck assembly and high density plasma device possessing the assembly
A high-density plasma and chuck technology, which is applied in the fields of plasma, electrical components, semiconductor/solid-state device manufacturing, etc., can solve problems such as film damage and rice grain defects
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[0032] The present invention will be described more fully herein with reference to the accompanying drawings in which embodiments of the invention are shown. However, this invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, the disclosed embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. In the drawings, the size and relative sizes of layers and regions may be exaggerated for clarity. In addition, each embodiment described and illustrated herein includes its complementary conductivity type embodiment as well. Like numbers refer to like elements throughout.
[0033] It will be understood that when an element or layer is described as being "on," "connected to" and / or "coupled to" another element or layer, it can be directly on , connected or coupled to another element or layer or intervenin...
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