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Casing of electronic apparatus and manufacturing method thereof

A technology for electronic devices and manufacturing methods, applied in the direction of electrical equipment shells/cabinets/drawers, electrical components, etc., can solve the problems that plastic shells cannot meet the rigidity requirements, and achieve the effect of meeting the rigidity requirements and avoiding wear

Inactive Publication Date: 2009-01-07
SHENZHEN FUTAIHONG PRECISION IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The material of the electronic device casing is generally plastic, so when the electronic device casing becomes lighter and thinner, the plastic casing processed through the in-mold decoration process cannot meet the rigidity requirements

Method used

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  • Casing of electronic apparatus and manufacturing method thereof
  • Casing of electronic apparatus and manufacturing method thereof
  • Casing of electronic apparatus and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0023] Please refer to FIG. 1 , which shows an electronic device casing 20 according to a preferred embodiment of the present invention. The electronic device casing 20 includes an insert layer 22 and a substrate 24 . The base body 24 includes an outer surface 242 and an inner surface 244 , the outer surface 242 is an appearance surface when the electronic device casing 20 is used, and the inner surface 244 is a surface opposite to the outer surface 242 . The insert layer 22 is disposed on the outer surface of the base body 24 , and the insert layer 22 and the base body 24 are integrally formed by in-mold injection.

[0024] The insert layer 22 includes a thin film layer 222 and a hard layer 224 , and the thin film layer 222 is formed on the hard layer 224 .

[0025] The hard layer 224 can be made of metal, glass or ceramics, and defines a through hole 2242 corresponding to the display window (not shown) of the electronic device using the electronic device housing 20 .

[002...

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PUM

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Abstract

The invention provides an electronic case, comprising an embedding layer and a substrate; the embedding layer and the substrate are integrally formed by a method of injection in mould; the embedding layer comprises a film layer and a hard medium layer; the film layer is formed on the hard medium layer. The invention also provides a preparation method used for the electronic device case. The electronic device case of the invention can avoid the abrasion of patterns owning to the factors such as usage, etc. as the patterns are formed on a first surface of the film layer and the first surface faces to the hard medium layer. Meanwhile, after the film layer and the hard medium layer are jointed and form the embedding layer, the embedding layer and the substrate are integrally formed by the method of injection in mould. Therefore, when the electronic device case is thinned, the rigidity requirement can be met by the hard medium layer.

Description

technical field [0001] The invention relates to an electronic device casing and a manufacturing method thereof. Background technique [0002] With the development of mobile communication technology, various electronic devices such as mobile phones are emerging, so that consumers can fully enjoy the convenience brought by mobile technology anytime and anywhere, thus portable electronic devices are becoming more and more popular among consumers. favored by. [0003] The casing is one of the main components of electronic devices, and it is widely used in electronic devices such as telephones, calculators, and computers. However, in order to improve the decoration of the electronic device, patterns are generally printed on the casing of the electronic device. [0004] The existing method for forming patterns on the electronic device casing is to directly print the pattern on the electronic device casing by mimeograph. Since the pattern is exposed on the surface of the housing...

Claims

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Application Information

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IPC IPC(8): H05K5/00B29C45/14B29C45/26
Inventor 许哲源瑞斯特苏振文黄刚王彦民
Owner SHENZHEN FUTAIHONG PRECISION IND CO LTD
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