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Window base material, card having module housed therein, and method for manufacturing card having module housed therein

A built-in, base material technology, applied to record carriers, printing, instruments, etc. used in machines, can solve problems such as poor appearance and lower yield, and achieve the effect of suppressing poor appearance and keeping secrets

Inactive Publication Date: 2012-09-26
TOPPAN MOORE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, there is a problem that the yield decreases due to poor appearance

Method used

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  • Window base material, card having module housed therein, and method for manufacturing card having module housed therein
  • Window base material, card having module housed therein, and method for manufacturing card having module housed therein
  • Window base material, card having module housed therein, and method for manufacturing card having module housed therein

Examples

Experimental program
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Embodiment Construction

[0031] A description will be given of the window base material of the present invention, a module built-in card provided with the window base material, and the best method for manufacturing the module built-in card.

[0032] It should be noted that this aspect is an example specifically explained in order to better understand the gist of the invention, and as long as it is not particularly limited, the invention is not limited.

[0033] [Window base material] Figure 1A with Figure 1B Is a schematic diagram showing an embodiment of the window substrate of the present invention, Figure 1A Is a floor plan, Figure 1B Is along Figure 1A A cross-sectional view of the line A-A.

[0034] Figure 1A In and B, the symbol 10 represents a window substrate, 11 represents a colored portion, 12 represents a window portion, 13 represents an intermediate layer, 14 represents a first substrate, and 15 represents a second substrate.

[0035] The window substrate 10 of this embodiment is roughly comp...

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PUM

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Abstract

The present invention discloses a window base material is provided with an intermediate layer having a window section made of a transparent resin and a colored section made of a colored resin surrounding the window section; and transparent first base material and second base material sandwiching the intermediate layer. A card having a module housed therein is provided with a module having a display element; an adhesive layer covering the module; and a pair of third base material and fourth base material sandwiching the module by having the adhesive layer in between. The third base material iscomposed of the window base material, and the display section of the display element is arranged to face the window section of the window base material. Thus, the easily manufactured card which houses the display element as an electronic component and permits the display section of the display element to be visually inspected from the external is provided.

Description

Technical field [0001] The present invention relates to a card with a built-in module in which a module including an electronic component such as an IC chip is built in, and more particularly to a card with a built-in module in which a display element is built in as an electronic component and the display portion of the display element can be visually observed from the outside. [0002] In addition, the present invention relates to a window base material used in the above-mentioned module built-in type card, a built-in module type card provided with the window base material, and a method of manufacturing the built-in module type card. [0003] This application claims the priority of Japanese Patent Application No. 2006-301520 and Japanese Patent Application No. 2006-301522 filed in Japan on November 7, 2006, and uses the content thereof. Background technique [0004] At present, in cards such as IC cards built-in modules with electronic components such as IC chips, diodes, etc., in o...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06K19/077B42D15/10G06K19/07
Inventor 樱井孝浩伊藤悠一
Owner TOPPAN MOORE CO LTD