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Optical element, radiation-emitting component and method for producing an optical element

An optical component and a radiation-emitting technology, applied in the field of optical components, can solve problems such as lens blur and lens deformation

Inactive Publication Date: 2012-06-20
OSRAM OPTO SEMICON GMBH & CO OHG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In the case of thermoplastic materials, there is a risk of deformation of the lens, for example in the event of thermal loads during the welding process, and there is also a risk of the lens becoming blurred

Method used

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  • Optical element, radiation-emitting component and method for producing an optical element
  • Optical element, radiation-emitting component and method for producing an optical element
  • Optical element, radiation-emitting component and method for producing an optical element

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Embodiment Construction

[0052] exist figure 1 In the radiation-emitting component 10 shown schematically in , an optical element 1 and two radiation-emitting semiconductor bodies 4 are shown in cross section. The semiconductor body 4 is embedded in the filling body 3 with the filling material 7 . Filling body 3 is only partially surrounded by base body 2 . In the region of the semiconductor body 4 the base body 2 has an opening region 6 . The semiconductor body 4 can thus be arranged on the carrier 5 through the opening region 6 after mounting the base body 2 . Furthermore, the open area 6 is used for filling the base body 2 with a filling material 7 which is preferably a gel during filling. Here, the base body 2 is dimensionally stable. The base body 2 and the carrier 5 delimit a cavity filled with a filling material 7 . Filling body 3 is thus formed. Filler 3 is transparent to the radiation generated by semiconductor body 4 .

[0053] In this embodiment, the filler material 7 arranged betwee...

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PUM

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Abstract

The invention relates to an optical element (1) having a base body (2) that contains a base material (13), and a filling body (3) that contains a filling material (7). Said filling body adheres to thebase body (2). The invention also relates to a radiation-emitting component (10) and to a method for producing an optical element (1).

Description

technical field [0001] The invention relates to an optical element and to a radiation-emitting component comprising the optical element. Furthermore, the invention relates to a method for producing an optical element. Background technique [0002] This patent application claims priority from German patent application 102006046301.3, the disclosure content of which is hereby incorporated by reference. [0003] A surface-mountable LED housing in which an LED chip is arranged is known from the publication DE 199 45 675 A1. A lens comprising thermoplastic material is arranged behind the chip. [0004] In the case of thermoplastic materials, there is a risk of deformation of the lens and, furthermore, a risk of clouding of the lens, for example in the event of thermal loading during a welding process. These effects can negatively affect the optical properties of the lens. Contents of the invention [0005] The object of the present invention is to specify an optical element...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/00H01L33/54H01L33/58
CPCH01L33/58H01L33/54H01L25/0753H01L2224/48091H01L2924/0002H01L2933/005H01L2924/00014
Inventor S·格罗特希
Owner OSRAM OPTO SEMICON GMBH & CO OHG