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Platen device

A technology of pressing plate and driving device, which is applied in the direction of stamping machines, presses, manufacturing tools, etc., and can solve problems such as difficult recycling, affecting product yield, and defective products

Active Publication Date: 2011-12-21
SHANGHAI MUNICIPAL ELECTRIC POWER CO +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, before gold plating and gold plating, the surface of the circuit board needs to be covered with an anti-plating film to prevent the deposition of nickel and gold in areas that do not need to form a nickel and gold layer, resulting in cost waste
[0003] After the flexible circuit board is gold-plated and gold-plated, before entering the next process, the anti-coating film needs to be torn off manually. Since the flexible circuit board is soft, the operator needs to fix the flexible circuit board with one hand when tearing off the anti-coating film. Slowly tear off the anti-coating film with the other hand, it is very easy to break the flexible circuit board due to improper force, resulting in defective products, and the torn anti-coating film is usually wrinkled and difficult to recycle
Therefore, manually tearing the anti-coating film is labor-consuming and time-consuming, affects the yield of the product, and increases the cost of making the flexible circuit board

Method used

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Examples

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Embodiment Construction

[0012] The pressing plate device provided by the technical solution will be further described in detail below in conjunction with the accompanying drawings.

[0013] see figure 1 and figure 2 , Embodiment 1 of the present technical solution provides a platen pressing device 100 , which includes a frame 11 , a loading plate 12 , a driving device 10 , a holding member 14 , and a controller 16 . The frame 11 includes a stage 111 and a bracket 112, the carrier plate 12 is fixed on the stage 111, the driving device 10 is installed on the bracket 112, the holding member 14 is connected to the driving device 13, the controller 16 and The driving device 10 is connected to control the action of the driving device 13 to move the holding member 14 closer to or away from the supporting plate 12 .

[0014] The carrier 111 has a substantially rectangular carrying surface. The bracket 112 includes two support plates 114 , a holding plate 113 and a mounting base 115 . The two support pla...

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PUM

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Abstract

A plate pressing device, which includes: a frame, the frame includes a carrier and a bracket, and the bracket is located on one side of the carrier; a carrier plate for carrying a circuit board, and the carrier plate is fixed on the carrier; a driving device, the driving device is installed on The bracket; the holding part, the holding part includes a supporting part and a pressing part, the supporting part has opposite first surface and second surface, the center of the first surface of the supporting part is connected with the driving device, The pressing part is fixed on the supporting part and is in contact with the second surface of the supporting part, the pressing part is opposite to the bearing plate, and the pressing part is controlled by the driving device to approach or move away from the supporting plate, so that the pressing part presses One end of the circuit board that is close to or away from the carrier board; a controller, the controller is connected with the drive device, and it is used to control the drive device to drive the holding member to move closer to or away from the carrier board. By using the plate pressing device, the operation mode of tearing the anti-coating film and manually pressing the circuit board can be changed.

Description

technical field [0001] The invention relates to the field of flexible circuit board production, in particular to a plate pressing device in the production process of the flexible circuit board. Background technique [0002] In the production process of the circuit board, in order to protect the plug-in terminals (commonly known as gold fingers) and provide good connection performance, it is necessary to form a layer of high-hardness, wear-resistant nickel layer and highly chemically passive gold on the plug-in terminals of the circuit board. layer, please refer to the article published by Yu Hin Chan et al. in the Proceedings of the 4th International Forum on Electronic Materials and Packaging in 2002, December 2002, pages 69-76: Wire bondability of Au / Nibond pads: effects of metallisation schemes and processing conditions. In the flexible circuit board manufacturing process, the method of forming a nickel-gold layer on the gold finger is generally gold plating and gold pla...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B30B1/38
Inventor 黄庭总黄鼎舜涂成达李文钦
Owner SHANGHAI MUNICIPAL ELECTRIC POWER CO
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