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Pressure device

A technology of pressing plate and driving device, which is applied in the direction of punching machine, press machine, manufacturing tool, etc., can solve the problems of manual tearing of anti-coating, time-consuming, waste of cost, and defective products.

Active Publication Date: 2009-10-21
SHANGHAI MUNICIPAL ELECTRIC POWER CO +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, before gold plating and gold plating, the surface of the circuit board needs to be covered with an anti-plating film to prevent the deposition of nickel and gold in areas that do not need to form a nickel and gold layer, resulting in cost waste
[0004] After the flexible circuit board is gold-plated and gold-plated, before entering the next process, the anti-coating film needs to be torn off manually. Since the flexible circuit board is soft, the operator needs to fix the flexible circuit board with one hand when tearing off the anti-coating film. Slowly tear off the anti-coating film with the other hand, it is very easy to break the flexible circuit board due to improper force, resulting in defective products, and the torn anti-coating film is usually wrinkled and difficult to recycle
Therefore, manually tearing the anti-coating film is labor-consuming and time-consuming, affects the yield of the product, and increases the cost of making the flexible circuit board

Method used

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Experimental program
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Embodiment Construction

[0014] The pressing plate device provided by the technical solution will be further described in detail below in conjunction with the accompanying drawings.

[0015] see figure 1 and figure 2 , Embodiment 1 of the present technical solution provides a platen pressing device 100 , which includes a frame 11 , a loading plate 12 , a driving device 10 , a holding member 14 , and a controller 16 . The frame 11 includes a stage 111 and a bracket 112, the carrier plate 12 is fixed on the stage 111, the driving device 10 is installed on the bracket 112, the holding member 14 is connected to the driving device 13, the controller 16 and The driving device 10 is connected to control the action of the driving device 13 to move the holding member 14 closer to or away from the supporting plate 12 .

[0016] The carrier 111 has a substantially rectangular carrying surface. The bracket 112 includes two support plates 114 , a holding plate 113 and a mounting base 115 . The two support pla...

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PUM

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Abstract

The invention relates to a pressure device which comprises an engine frame, a loading plate, a driving device, a pressure holding piece and a controller; wherein the engine frame comprises a loading platform and a bracket positioned on one side of the loading platform; the loading plate is fixed on the loading platform; the driving device is arranged on the bracket; the pressure holding piece is connected with the driving device which controls the pressure holding piece to be close to or far from the loading platform; the controller is connected with the driving device and is used for controlling the driving device to drive the pressure holing piece to do the movement close to or far from the loading platform. The pressure device can change the operating type of a preventing plated film manual hold-down circuit wafer.

Description

technical field [0001] The invention relates to the field of flexible circuit board production, in particular to a plate pressing device in the production process of the flexible circuit board. Background technique [0002] In the production process of the circuit board, in order to protect the plug-in terminals (commonly known as gold fingers) and provide good connection performance, it is necessary to form a layer of high-hardness, wear-resistant nickel layer and highly chemically passive gold on the plug-in terminals of the circuit board. layer, please refer to the article published by Yu Hin Chan et al. in the Proceedings of the 4th International Forum on Electronic Materials and Packaging in December 2002 on pages 69-76: Wire bondability of Au / Ni bond pads: effects of metallisation schemes and processing conditions. [0003] In the flexible circuit board manufacturing process, the method of forming a nickel-gold layer on the gold finger is generally gold plating and go...

Claims

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Application Information

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IPC IPC(8): B30B1/38
Inventor 黄庭总黄鼎舜涂成达李文钦
Owner SHANGHAI MUNICIPAL ELECTRIC POWER CO
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