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Flexible film and display device including the same

A technology for display devices and flexible films, applied in the field of flexible films, can solve problems such as difficult manufacturing of FPCBs

Inactive Publication Date: 2012-07-18
LG ELECTRONICS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the lamination method, it is not easy to manufacture FPCB or FCCL due to the limitations of the physical properties of the adhesive used

Method used

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  • Flexible film and display device including the same
  • Flexible film and display device including the same
  • Flexible film and display device including the same

Examples

Experimental program
Comparison scheme
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Embodiment Construction

[0033] Reference will now be made to detailed embodiments of the invention, examples of which are illustrated in the accompanying drawings.

[0034] figure 1 shows a flexible membrane according to an exemplary embodiment, and Figure 2-5 is along figure 1 The cross-sectional view taken along the line I-I'.

[0035] Such as Figure 1~5 As shown, the flexible film 100 may include an insulating film 110 having at least one hole 120 and first and second metal layers 131 and 132 on the insulating film 110 . The insulating film 110 may include a first surface 111 a corresponding to an inner peripheral surface of the hole 120 , a second surface 111 b corresponding to an upper surface of the insulating film 110 , and a third surface 111 c corresponding to a lower surface of the insulating film 110 . The first metal layer 131 and the second metal layer 132 may be on the first surface 111a and on at least one of the second and third surfaces 111b and 111c. In the flexible film 100,...

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Abstract

A flexible film and a display device including the same are disclosed. The flexible film includes an insulating film and first and second metal layers on the insulating film. The insulating film including at least one hole, a first surface corresponding to an inner circumferential surface of the hole, a second surface corresponding to an upper surface of the insulating film, and a third surface corresponding to a lower surface of the insulating film. The first metal layer and the second metal layer are positioned on the first surface and at least one of the second and third surfaces. An anglebetween the first surface and the second surface is equal to or greater than an angle between the first surface and the third surface.

Description

technical field [0001] Exemplary embodiments relate to flexible films, and more particularly, to flexible films for various electrical devices. Background technique [0002] Flexible films can be used in various electrical devices. As examples of the flexible film, a flexible printed circuit board (FPCB) and a flexible copper clad laminate (FCCL) can be cited. [0003] The metal layer of the FPCB or FCCL is manufactured using a sputtering method, a casting method, or a lamination method. [0004] In the sputtering method, a sputtering process is performed on a polyimide film to form a metal layer. In the casting method, liquid polyimide is coated on a metal thin film, and then a casting process is performed to thereby form a metal layer of the FCCL. In the lamination method, an adhesive is coated on the polyimide film, and a metal thin film is adhered to the polyimide film using the lamination method. [0005] In the sputtering method, since the surface of the polyimide ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/02H05K3/38G02F1/13
CPCG02F1/1345H05K1/0393H05K1/118H05K3/388H05K2201/10128
Inventor 廉晶燮高东起
Owner LG ELECTRONICS INC