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Rigid and flexible circuit board and manufacture method thereof

A flexible circuit board and a manufacturing method technology, applied in multilayer circuit manufacturing, printed circuit manufacturing, printed circuit and other directions, can solve the problems of low connection reliability of electroplating connection parts, and achieve the effect of high reliability

Inactive Publication Date: 2013-07-03
IBIDEN CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the connection reliability of the plated connection part is low

Method used

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  • Rigid and flexible circuit board and manufacture method thereof
  • Rigid and flexible circuit board and manufacture method thereof
  • Rigid and flexible circuit board and manufacture method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0050] Next, a flex-rigid wiring board 10 according to an embodiment of the present invention will be described.

[0051] Such as Figure 1A and 1B As shown, the flex-rigid wiring board 10 according to the embodiment of the present invention is composed of a first rigid substrate (rigid substrate) 11, a second rigid substrate 12, and a flexible substrate (flexible substrate) 13 connecting the rigid substrates 11 and 12.

[0052] Arbitrary circuit patterns can be formed on the first rigid substrate 11 and the second rigid substrate 12 . In addition, electronic components such as semiconductor chips and the like may be connected as needed.

[0053] Stripe wiring 13 a for connecting the circuit patterns of the first rigid substrate 11 and the second rigid substrate 12 is formed on the flexible substrate 13 . The wiring 13 a connects the circuit patterns of the rigid substrates 12 , 12 to each other.

[0054] Next, taking the junction of the rigid substrate 11 and the flexible su...

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PUM

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Abstract

The invention provides a rigid and flexible circuit board and a manufacture method thereof. A flexible substrate (13) with conductor patterns (132 and 133) and an inflexible substrate (112) with rigidity are configured in parallel in the horizontal direction; insulating layers (111 and 113) are used to cover the flexible substrate (13) and the inflexible substrate (112) and enable at least one part of the flexible substrate (13) to expose outside; accesses (116 and 141) to the conductor patterns (132 and 133) of the flexible substrate (13) are formed on the insulating layers (111 and 113), and wirings (117 and 142) reaching conductor patterns (132 and 133) are formed by electroplating and the accesses (116 and 141); and insulating layers (114,115,144 and 145) are overlapped on the insulating layers (111 and 113) to form circuits (123 and 150) to connect wirings.

Description

[0001] (This application is a divisional application of an application with an application date of October 24, 2006, an application number of 200680034932.1, and an invention titled "rigid-flexible circuit board and its manufacturing method".) technical field [0002] The present invention relates to a bendable circuit board partially composed of a flexible substrate and a manufacturing method thereof. Background technique [0003] For example, Patent Documents 1 to 3 disclose rigid-flex wiring boards in which a part of the substrate is rigid and the other part is flexible. [0004] The flex-rigid wiring board disclosed in Patent Document 1 has a core substrate with a rigid portion, a flexible substrate arranged adjacent to the core substrate in the horizontal direction of the core substrate, and a flexible adhesive laminated on the core substrate and the flexible substrate. The adhesive layer, the wiring pattern formed on the flexible adhesive layer located in the rigid par...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/00H05K3/00H05K3/46
Inventor 高桥通昌青山雅一
Owner IBIDEN CO LTD