Double sticky tape and punching method thereof

Abstract

The invention provides a method for punching a double sticky tape. The method comprises the following steps: drawing an orthographic projection of an irregular structure or a part of a stuck object onthe plane of the double sticky tape; spreading and placing the double sticky tape to be punched on cutting equipment, and punching the double sticky tape along the outline of the orthographic projection; and punching a straight line along a direction opposite to the direction of tearing off release paper, wherein the starting point of the straight line is in the outline of the orthographic projection, and the length of the straight line is greater than the height of the irregular structure or the part. The double sticky tape comprises foam, two adhesive layers which sandwiches the foam, and the release paper which is stuck on the outside adhesive layer; after being punched, the double sticky tape is also provided with the straight line formed by punching and the outline which is easy to peel off the punched part; the starting point of the straight line is positioned in the outline; and the direction of the straight line is opposite to the direction of tearing off the release paper. The invention provides the double sticky tape which has convenient punching, time-saving adhesion and convenient tearing of the release paper, and the method for punching the same.

Description

technical field [0001] The invention relates to a double-sided adhesive tape and a punching method thereof. Background technique [0002] In production and life, people often need to use double-sided tape to paste one object (to be pasted) to another object (to be pasted). However, since the object to be pasted may have an irregular shape or there are other structures or parts on the surface of the object to be pasted, that is, the surface of the object to be pasted for pasting the tape is not flat, and the double-sided tape needs to be punched in advance. It can be used, otherwise it will greatly affect the production efficiency. [0003] In order to smoothly avoid other structures or parts on the object to be pasted when pasting the double-sided tape and tearing off the release paper of the double-sided tape, the following methods are usually used to die-cut the tape: [0004] 1. Die and cut off the large space occupied by other structures or parts on the adhesive tape 3...

AI Technical Summary

Problems solved by technology

[0006] For the first punching method, since the structure or components need to be avoided when the release paper 4 is torn off, a lot of tapes 3 need to be punched off, which reduces the bonding area and affects the bonding effect; for the second A punching method, because the adhesive tape 3 is punched into multiple pieces, so it is time-consuming and laborious when punching, sticking and tearing the release paper 4, and this method is basically only applicable to larger-sized objects 2 or Parts

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