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Preparation of organic light emitting diodes by a vapour deposition method combined with vacuum lamination

A light-emitting diode, organic technology, applied in semiconductor/solid-state device manufacturing, electrical components, electric solid-state devices, etc., can solve the problem of low mechanical adhesion

Inactive Publication Date: 2010-03-03
KONINK PHILIPS ELECTRONICS NV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

These experiments were carried out in an argon atmosphere containing less than 5 ppm oxygen or water, however the mechanical adhesion is low and the layers can be easily delaminated

Method used

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  • Preparation of organic light emitting diodes by a vapour deposition method combined with vacuum lamination
  • Preparation of organic light emitting diodes by a vapour deposition method combined with vacuum lamination
  • Preparation of organic light emitting diodes by a vapour deposition method combined with vacuum lamination

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Embodiment Construction

[0018] In one embodiment of the present invention, there is provided a method of manufacturing an OLED comprising the steps of: providing first and second substrates; removing dust particles from said substrates; coating the first and second substrates respectively by vapor deposition; and a second substrate; and laminating the first and second substrates together under vacuum.

[0019] Dust particles on the substrate can be largely removed by several methods or combinations thereof. In an exemplary embodiment, dust particles can be removed by, for example, megasonic or ultrasonic cleaning in ultrapure water. In another exemplary embodiment, the dust particles can be removed by charging the dust particles and removing the at least partially charged dust particles in an electric field.

[0020] In an exemplary embodiment, the dust particles can be negatively charged with a beam of electrons that can be generated, for example, by a differentially pumped electron gun, similar to...

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PUM

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Abstract

A method of fabricating an organic light emitting diode (OLED) is disclosed, which reduces the formation of physical defects in the GLED, comprising the removal of dust particles from a first and a second substrates (40, 90), separately coating the first and the second substrate using a vapour deposition method (50, 80) and laminating the first and the second substrate together in vacuum.

Description

technical field [0001] The present invention relates to organic light emitting diodes (OLEDs), and more particularly to a method of making organic light emitting diodes that reduces the formation of physical defects in OLEDs. Background technique [0002] Organic light emitting diodes (OLEDs) typically consist of an organic light-emitting layer flanked by additional organic layers that facilitate charge transport and include a hole-transport layer and an electron-transport layer. These organic layers are sandwiched between two electrode layers, the anode and cathode layers, which are both covered on one side with a substrate for protection and stability. [0003] Conventionally, OLEDs are fabricated by vapor deposition of electrode layers and organic layers performed in high or ultra-high vacuum. While this technique offers certain advantages in terms of control over the thickness of each layer as well as sufficient purity of the materials and good layer adhesion, one of th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L51/52
CPCH01L51/0024H10K71/50
Inventor G·F·盖特纳H·F·博尔纳
Owner KONINK PHILIPS ELECTRONICS NV