Chemical mechanical polishing equipment
A chemical machinery and equipment technology, applied in the field of chemical mechanical polishing equipment, can solve the problems of waste of grinding liquid and poor uniformity of silicon wafer grinding, and achieve the effects of uniform grinding, high silicon wafer yield and effective use.
Active Publication Date: 2011-08-24
SHANGHAI HUAHONG GRACE SEMICON MFG CORP
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Problems solved by technology
In the prior art, since the silicon wafer 7 moves back and forth on the grinding table 9, it is far and sometimes close to the liquid medicine distribution position 10, so there is a waste of a certain amount of grinding liquid and poor uniformity of silicon wafer grinding.
Method used
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Embodiment Construction
[0016] Such as image 3 As shown, the CMP equipment of the present invention includes the parts of the existing CMP, the grinding head 6 carries the silicon wafer 7 and grinds on the grinding pad 8, the back pressurizing device 1 and the grinding head 6 realize the back pressure of the silicon wafer 7, and the grinding The head 6 is fixed on the rotating terminal of the back pressing device 1 through the clamp ring 5, and under the action of the rotating motor 2, the back pressing device 1, the clamp ring 5, the grinding head 6 and the silicon wafer 7 Rotate together on the grinding pad 8, the motor fixing device 3 carries the grinding head rotating motor 2 to move back and forth on the grinding head translation slide rail 4, at a certain fixed position above the grinding table 9 A grinding liquid distribution terminal 10 is arranged at the position, and a dynamic grinding liquid distribution terminal 11 is arranged at the bottom of the motor fixing device 3, and moves on the ...
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The invention discloses chemical mechanical polishing equipment, which comprises a polishing table, a polishing pad, a polishing head for bearing a silicon chip, a translational sliding rail of the polishing head along the radius direction of the polishing table, and a back pressure device. The polishing head is fixed at a rotary terminal of the back pressure device through a clamp ring; a rotarymotor of the polishing head rotates the back pressure device, the clamp ring, the polishing head and the silicon chip together on the polishing pad; meanwhile, the rotary motor of the polishing head is born on the translational sliding rail of the polishing head for translating back and forth through a fixing device for the motor; and the polishing table and the polishing pad rotate together. The chemical mechanical polishing equipment further comprises a dynamic polishing liquid distribution terminal arranged at the bottom of the motor fixing device; and the dynamic polishing liquid distribution terminal moves with the motor fixing device synchronously on the translational sliding rail. An upper end of the dynamic polishing liquid distribution terminal is provided with a distribution groove receiving the polishing liquid which flows out of the polishing liquid distribution terminal, and a lower end of the dynamic polishing liquid distribution terminal is provided with a liquid medicine distribution pipeline. The chemical mechanical polishing equipment has the advantages of improving the utilization rate of liquid medicine, and making the polishing more uniform.
Description
technical field [0001] The invention relates to the technical field of chemical mechanical polishing in semiconductor process manufacturing, in particular to a chemical mechanical polishing equipment. Background technique [0002] Chemical Mechanical Polisher (CMP) equipment is a necessary equipment in the chemical mechanical polishing process of the semiconductor industry. like figure 1 As shown, typical CMP equipment has common characteristics in terms of hardware composition: the grinding head 6 carries the silicon wafer 7 for grinding on the grinding pad 8, and there is a special supply pipeline for the grinding liquid distribution terminal 10 to provide grinding during grinding. liquid. The existing CMP chemical polishing liquid adopts the method of fixed position distribution: that is, a polishing liquid distribution terminal 10 is set at a fixed position above the polishing table 9, and the polishing liquid distribution terminal 10 distributes the chemical liquid wh...
Claims
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IPC IPC(8): B24B37/04B24B7/22B24B57/02B24B37/07
Inventor 祝志敏金新
Owner SHANGHAI HUAHONG GRACE SEMICON MFG CORP