Single-component dealcoholization-type organic silicon sealant

A dealcoholized, silicone technology, used in adhesives, other chemical processes, chemical instruments and methods, etc., can solve the problems of lack of "double 85" resistance, unsatisfactory effect, and inability to bond and seal solar modules. To achieve good reinforcement, reduce the requirements of production process, improve the effect of crosslinking density
CN101760172AInactive Publication Date: 2010-06-30HUBEI HUITIAN NEW MATERIALS STOCK CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
HUBEI HUITIAN NEW MATERIALS STOCK CO LTD
Publication Date
2010-06-30
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention relates to a single-component dealcoholization-type organic silicon sealant which belongs to the technical field of single-component organic silicon sealant and mainly solves the problem of poor adhesiveness and storage stability of the traditional sealant. The single-component dealcoholization-type organic silicon sealant comprises the following components in percentage by weight: 30-70 wt% of hydroxy-terminated poly dimethylsiloxane polymer, 15-50 wt% of nano-scale calcium carbonate, 2-10 wt% of alkoxy silane crosslinker, 0.1-3 wt% of titanate chelate catalyst, 1-5 wt% of thixotropic agent, 0.05-2 wt% of titanate catalyst, 0.1-2 wt% of coupling agent and 0.5- 5wt% of silicone oil plasticizer. The invention has favorable mechanical performance and excellent adhesiveness as well as double-85 resistant performance, has simple construction process and is widely used for splicing and sealing solar modules in the solar photovoltaic industry.
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Description

technical field

[0001] The invention belongs to the technical field of single-component silicone sealants, and specifically relates to a kind of "double 85" resistance ((85°C, 85% RH) × 1000h after tensile strength, elongation, hardness and other indicators requirements), storage Stable and excellent adhesive sealant, directly used for solar photovoltaic module frame sealing and bonding of junction boxes and other components, effectively protecting silicon wafers from pollution and oxidation, bonding, fixing, sealing and insulating of electronic and electrical parts, Encapsulation and protection of outdoor LED display and backlight. It has high strength and high adhesion, and ensures that the composite film of the bonded component will not yellow. The invention is mainly applied to the bonding and sealing of solar modules in the solar photovoltaic industry. Background technique

[0002] U.S. Patent No. 4,687,829 uses a terminal alkoxy silicon ethylene catalyst to improve s...

Claims

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