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Configurable two-dimensional micro-plasma array device and preparation method thereof

A micro-plasma and array technology, which is applied in cold cathode manufacturing, electrode system manufacturing, discharge tube/lamp manufacturing, etc., can solve the problems of complex process, inability to take into account large size and addressability, and high cost, and achieve improved The effects of array density, increased size flexibility, and reduced process difficulty and production cost

Inactive Publication Date: 2010-08-04
SHANDONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

This technology uses small sheets made up from plastic or metal that can be easily assembled into different shapes for use with electronic devices such as sensors. These sheets have tiny holes on them which allow charged particles like electrons to pass through without being blocked by other objects during operation. By doing this they make it easier and more flexible than traditional methods used to create arrays. They also reduce manufacturing costs while maintaining their effectiveness at detecting certain types of chemical substances.

Problems solved by technology

This patented describes various technical problem addressed in these inventors' documents relating to improving the stability and performance of tiny electrically charged particles (called "molten atoms") during their formation within an ambient atmosphere called a "microsphere." These miniature objects may cause damage or contamination when they enter another environment where harmful substances exist that could affect human health if released from them. Micropolar Plasmons (MP) represent one type of atom which generates strong electric fields at low temperatures without being affected by external factors like sunlight. By focusing certain types of MIPS onto specific areas around the nanoparticles, we aimed towards creation of smaller and less expensive systems capable of detecting minute amounts of materials present inside environments.

Method used

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  • Configurable two-dimensional micro-plasma array device and preparation method thereof
  • Configurable two-dimensional micro-plasma array device and preparation method thereof
  • Configurable two-dimensional micro-plasma array device and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0032] Such as figure 1 with figure 2 As shown, the assembleable two-dimensional micro-plasma array device of the present invention is composed of an electrode layer 100 and a microcavity layer 200, and the thickness of each layer can range from 1 micron to several thousand microns. Both the electrode layer 100 and the microcavity layer 200 include at least two positioning holes 300 , the electrode layer 100 and the microcavity layer 200 are stacked alternately, and the positioning holes 300 of each layer must be aligned. The outermost part of the device is the electrode layers 100(0) and 100(N), the zeroth electrode layer 100(0) is connected to the first microcavity layer 200(1), aligned through the positioning holes, the two are in close contact, Leave no gaps in between. The first electrode layer 100(1) is connected to the first microcavity layer 200(2), aligned through the positioning holes, and they are in close contact with each other without leaving a gap in between....

Embodiment 2

[0035] In this embodiment, two bus electrodes are provided on the basis of Embodiment 1. Such as image 3 As shown, the odd-numbered layers 100(1), 100(3), ... of the electrode layers are connected to the first bus electrode 601, and the even-numbered layers 100(0), 100(2), ... of the electrode layers are connected to the first bus electrode 601. The two bus electrodes 602 are connected, and a microcavity layer is included between each even-numbered layer and each odd-numbered layer in the electrode layers, and an AC voltage or a DC voltage is applied between the first electrode bus 601 and the second bus electrode 602, so that Array discharges.

Embodiment 3

[0037] In this embodiment, on the basis of Embodiment 2, a third bus electrode is added. Such as Figure 4 As shown, there is a microcavity layer between each even-numbered layer and every odd-numbered layer in the electrode layers, and the microcavity layers 200 ( 1 ), 200 ( 2 ), . . . are connected to the third bus electrode 603 . Applying an AC voltage or a DC voltage between the first electrode bus 601 and the second bus electrode 602 can be used as a discharge sustaining electrode, responsible for maintaining the state of the discharge; the third bus electrode 603 can be used as an address electrode, and the row is set as the required point To light or not to light.

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PUM

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Abstract

The invention discloses a configurable two-dimensional micro-plasma array device and preparation method thereof. The device consists of at least two electrode layers and at least one micro-cavity layer which are stacked, the layers are contacted closely, the electrode layers are on the two outermost sides, and the electrode layers and the micro-cavity layer are all provided with at least two positioning holes and are aligned through the positioning holes; a conductive material sheet of a dielectric layer or an insulation sheet made of insulation material is covered on the surface of the micro-cavity layer; the edge of the micro-cavity layer is provided with sunken linear array micro-cavities, and the micro-cavities are isolated by a barrier; the electrode layers are the conductive material sheets; and electrodes are led out from the micro-cavity layer and the electrode layers respectively. The preparation method comprises the following steps: cutting a sheet material into the same rectangular sheets serving as the electrode layers and the micro-cavity layer, aligning the electrode layers with the micro-cavity layer, and assembling the electrode layers and the micro-cavity layers layer by layer as required. The size of a micro-plasma array can be flexibly changed, the process difficulty and cost are lowered, and the device array density, device size and reliability are improved.

Description

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Claims

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Application Information

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Owner SHANDONG UNIV
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