Clamping and protecting device for one-sided processing

Abstract

The invention relates to a device mainly used for clamping and protecting a silicon chip and similar substances to perform one-sided processing, in particular to a clamping and protecting device for the one-sided processing, which solves the problems of correctly placing the silicon chip or the similar substances on the device, safely clamping the silicon chip or the similar substances in high-speed rotation, and the like during the one-sided processing. The device is provided with a rotating disc and a rotating shaft, wherein the rotating disc is positioned above the device; the lower side of the rotating disc is connected with the hollow rotating shaft; the center of the upper surface of the rotating disc is provided with a cylindrical concave groove; a supporting frame is positioned atthe periphery of the upper surface of the rotating disc; the silicon chip or disc-shaped objects are arranged on the supporting frame; and gaps are reserved between the silicon chip or the disc-shaped objects and edges of the rotating disc. Gases are ejected from a nozzle of the rotating disc to form a rotating gas flow which forms a pressure condition, so one side of the silicon chip is attachedto the supporting frame of the rotating disc, and the rotating disc and the silicon chip rotate at the same time. The supporting frame of the rotating disc is abutted against the periphery of a roundsilicon chip, and can play a role in simultaneously positioning the silicon chip and the rotating disc.

Description

technical field [0001] The invention relates to a device mainly used for clamping and protecting silicon chips and similar objects for single-side processing, in particular to a clamping and protecting device for single-side processing. Background technique [0002] In the past few years, many remarkable advances have been made in microelectronic integrated circuit manufacturing technology, resulting in the production of more functional and cheaper electronic devices. A major factor driving this progress is new integrated circuit manufacturing equipment and With the invention of corresponding manufacturing technology, the preparation of microelectronic devices usually requires very precise control, very pure materials and a very clean preparation environment, and even the defects produced by submicron particles will lead to the failure of the entire microelectronic device. [0003] Microelectronic devices are generally fabricated on the front side of the silicon wafer, and t...

AI Technical Summary

Problems solved by technology

[0008] The purpose of the present invention is to provide a clamping and protecting device for single-sided processing, which solves the problems of correct placement on the device and safe clamping during high-speed rotation when silicon wafers or similar objects are processed on one side

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