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Photosemiconductor package sealing resin material

一种光半导体、密封树脂的技术，应用在半导体器件、半导体/固态器件零部件、电固体器件等方向，能够解决机械性能劣化等问题，达到良好透明性、高触变性、良好耐裂性的效果

Inactive Publication Date: 2010-11-24
DEXERIALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, suppression of discoloration by ultraviolet rays and suppression of deterioration in mechanical properties of cured sealing resin materials are pressing issues

Method used

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  • Photosemiconductor package sealing resin material
  • Photosemiconductor package sealing resin material
  • Photosemiconductor package sealing resin material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0044] Next, the present invention will be described more specifically by way of examples.

reference example 1

[0046] (Preparation of Epoxy-Clay Mineral Dispersion Using Hydrophobic Hectorite)

[0047] 5 g of hectorite (Lucentito SEN, Cop Chemical Co., Ltd.), which is a synthetic smectite, was added to 100 g of toluene, stirred at room temperature for 6 hours and dispersed to obtain a viscous clay mineral dispersion. It should be noted that the chemical formula of hectorite uses Na 0.33 (Mg 2.67 Li 0.33 ) Si 4 o 10 (OH) 2 Indicates that the hydrophobic hectorite used is a hectorite in which polyoxyethylene or alkylmethylammonium ions are intercalated.

[0048] The obtained clay mineral dispersion was added to the epoxy dispersion obtained by dispersing 45 g of liquid hydrogenated bisphenol A type epoxy compound (YX8000, Japan Epikisilesin Co., Ltd.) in 100 g of dimethylformamide in advance. After stirring for 24 hours, a colorless and transparent epoxy dispersion was obtained.

[0049] By concentrating the resulting epoxy dispersion under reduced pressure with an evaporator, an ...

reference example 2

[0051] (Preparation of Epoxy-Clay Mineral Dispersion Using Hydrophobic Bentonite)

[0052] 5 g of bentonite (Esben NX, Hogyun Co., Ltd.), which is a synthetic smectite, was added to 100 g of toluene, and stirred at room temperature for 6 hours to disperse to obtain a viscous clay mineral dispersion. It should be noted that the chemical formula of bentonite varies according to the synthesis conditions, but generally Na 0～0.66 Ca 0～0.66 (Mg 0～0.66 Al 3.34 ) Si 8 o 20 (OH) 4 It shows that the hydrophobic bentonite used is bentonite with trioctylammonium ions intercalated between layers.

[0053] The obtained clay mineral dispersion was added to an epoxy dispersion previously obtained by dispersing 45 g of a liquid hydrogenated bisphenol A epoxy compound (YX8000, Japan Epikisilesin Co., Ltd.) into 100 g of toluene, and stirred at room temperature for 24 hours. A colorless and transparent epoxy dispersion was obtained.

[0054] By concentrating the resulting epoxy dispersio...

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Abstract

This invention provides a photosemiconductor package sealing resin material for sealing a photosemiconductor chip in a semiconductor package. The photosemiconductor package sealing resin material contains a heat curable epoxy composition and a hydrophobic smectite clay mineral. The hydrophobic smectite clay mineral is produced by subjecting a hydrophilic smectite clay mineral to an intercalation reaction with an alkylammonium halide to hydrophobize the smectite clay mineral. Bentonite, saponite, hectorite, vermiculite, stevensite, taeniolite, montmorillonite, or nontronite may be mentioned as the smectite clay mineral.

Description

technical field [0001] The present invention relates to a colorless and transparent optical semiconductor package (photosemiconductor package) sealing resin material. Background technique [0002] Generally, in the representative way of component sealing used in the field of optical semiconductor chips such as LED (light-emitting diode element), photosensitive transistor, photodiode, CCD (charge-coupled device), EPROM (erasable programmable ROM), for example , it is known that (i) the optical semiconductor chip 2 is mounted on the ceramic container 1, and the transparent glass cover 4 is sealed in the ceramic container 1 with an adhesive resin 3 ( figure 1 ), (ii) mounting the optical semiconductor chip 2 in the ceramic container 1, filling the ceramic container 1 with a transparent optical semiconductor module sealing resin material 5 mainly composed of a thermosetting epoxy composition, and curing and sealing the ceramic container 1 ( figure 2 ), (iii) the optical semico...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08G59/42C08K3/34H01L23/29H01L33/00H01L23/31C08G59/20
CPCC08K3/346C08G59/226C08G59/42H01L23/295C08L63/00H01L33/56H01L2224/48091H01L2924/181C08L2666/54H01L2924/00014H01L2924/00012
Inventor 马越英明
Owner DEXERIALS CORP
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