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Laser-scribing platform and hybrid writing strategy

A technology of lasers and lasers, which is applied in laser welding equipment, optics, optical components, etc., can solve the problems of unallowable changes and inability to perform a few adjustments, and achieve the effect of improved control and high output

Inactive Publication Date: 2011-03-23
APPLIED MATERIALS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Furthermore, these devices do not allow variations in the scribe lines of patterns other than the desired flat lines in which
Even further, it is not possible to perform a small number of adjustments to minimize the deviation from the expected reticle position

Method used

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  • Laser-scribing platform and hybrid writing strategy
  • Laser-scribing platform and hybrid writing strategy
  • Laser-scribing platform and hybrid writing strategy

Examples

Experimental program
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Embodiment Construction

[0033] Systems and methods according to various embodiments of the present disclosure can overcome the above and other one or more disadvantages in existing scribing methods. Various embodiments may provide for improved control, and the ability to score in multiple directions and / or patterns without rotating the substrate. Apparatus according to various embodiments provide for general purpose, high throughput, guided patterned laser scribing on large thin film deposition substrates. Such a device allows for bidirectional scribing, patterned scribing, arbitrary pattern scribing, and / or adjustable pitch scribing without changing the orientation of the workpiece.

[0034] figure 1 An example of a laser scribing apparatus 100 that may be used in accordance with a number of embodiments is illustrated. The apparatus includes a bed or platform 102, which will typically be leveled, for receiving and manipulating a workpiece 104, such as a substrate having at least one layer deposite...

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PUM

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Abstract

Laser scribing can be performed on a workpiece (104) such as substrates with layers formed thereon for use in a solar panel without need to rotate the workpiece (104) during the scribing process. A series of lasers (602, 622) can be used to concurrently remove material from multiple positions on the workpiece (104). Each laser (602, 622) can have at least one scanning device (614, 630, 632) positioned along a beam path thereof in order to adjust a position of the laser output relative to the workpiece (104). By adjusting the beam or pulse positions using the scanning devices (614, 630, 632) while translating the workpiece (104), substantially any pattern can be scribed into at least one layer of the workpiece (104) without the need for any rotation of the workpiece (104).

Description

[0001] This application claims the benefit of U.S. Patent Application Nos. 61 / 044,021, filed April 10, 2008, and U.S. Patent Application Nos. 61 / 044,027, filed April 10, 2008, which are hereby incorporated by reference . technical field [0002] Various embodiments disclosed herein relate generally to the characterization of materials, and systems and methods for scribing these materials. Such systems and methods may be particularly effective in scribing single-junction solar cells and thin-film multi-junction solar cells. Background technique [0003] Current methods for forming thin film solar cells involve depositing or forming multiple layers on a substrate, such as a glass, metal or polymer substrate suitable for forming one or more p-n junctions. An example of a solar cell has an oxide layer (eg, a transparent conductive oxide (TCO) layer) deposited on a substrate, followed by an amorphous silicon layer and a metal support layer. Materials that can be used to form so...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/36B23K26/04B23K26/08B23K26/00H01L31/04G02B26/10
CPCB23K26/367B23K26/067B23K2203/16B23K26/362B23K26/0676B23K2201/36B23K2201/34B23K26/0807B23K26/16B23K26/083B23K26/409B23K26/361B23K26/364B23K26/082B23K26/40B23K2101/34B23K2101/36B23K2103/16B23K2103/172
Inventor 斯里兰·克里士纳瓦米栗田真一巴萨姆·沙莫恩本杰明·M·约翰斯顿约翰·M·怀特家发·范因晨·黄安托尼·P·马内斯伟圣·雷维勇·徐
Owner APPLIED MATERIALS INC
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