High-power light-emitting diode (LED) lamp cap with epoxy resin heat conduction pipe added with carbon nano tube material

Abstract

The invention discloses a modular high-power light-emitting diode (LED) lamp cap with an epoxy resin heat conduction pipe added with a carbon nano tube material for roadway lighting and a manufacturing method thereof and also discloses a method for preparing the epoxy resin heat conduction pipe added with the carbon nano tube material. In a high-power LED lamp module, a circuit board is clung to one surface of a radiating substrate, so that heat of each high-power LED luminous body welded on the circuit board can be conducted to the radiating substrate; radiating fins are fixedly arranged on the other surface of the radiating substrate; and the epoxy resin heat conduction pipe added with the carbon nano tube material is coupled with the radiating fins and the radiating substrate. The heat on the radiating substrate is rapidly conducted to the radiating fins by utilizing the performance of high thermal conductivity of the epoxy resin heat conduction pipe added with the carbon nano tube material, so that the heat cannot be congregated on the radiating substrate and the defect of heat dissipation of the high-power LED lamp cap in the prior art is overcome essentially.

Description

technical field [0001] The invention relates to a lamp head device configured for road lighting equipment, in particular to a method for improving heat dissipation efficiency of a high-power LED lamp head, a high-power LED lamp head prepared by the method, and a manufacturing method of a heat conduction device used therein. Background technique [0002] From the perspective of saving energy and prolonging the working life, in the prior art, lamp holders used for road lighting equipment, such as lamp holders of street lamps, have more and more commonly used high-power LEDs as light sources. As a semiconductor component, high-power LED is very sensitive to operating temperature. If a high-power LED is placed in an environment higher than the design working temperature for a long time, its stability and service life will be seriously affected. The large amount of heat generated by the high-power LED illuminant itself while emitting light in the normal working process is the ma...

AI Technical Summary

Problems solved by technology

This heat dissipation method reduces the weight of the product a lot. The overall heat dissipation area is sufficient, but the effective heat dissipation area is not enough, because the heat conduction channel is very small, and the heat can only be conducted through the ribs connecting the heat dissipation fins, which is not conducive to the rapid conduction of heat.

The common defect of the above two heat dissipation methods is that they both use the heat dissipation substrate to absorb the heat emitted by the high-power LED illuminant, and dissipate the heat with the help of the heat dissipation fins, but they lack the means to quickly transfer the heat from the heat dissipation substrate to the heat dissipation fins. The first method above is to realize heat conduction through the contact between the heat dissipation fins and the heat dissipation substrate; the second method above is to realize heat conduction through the contact between the heat dissipation fins and the heat dissipation substrate, and the ribs that are connected to both the heat dissipation fins and the heat dissipation substrate

However, neither of these two methods can conduct the heat accumulated on the heat dissipation substrate to the heat dissipation fins, causing the heat accumulated on the heat dissipation substrate to be much greater than the heat transferred to the heat dissipation fins

Therefore, the above two heat dissipation methods in the prior art cannot essentially solve the heat dissipation problem of the high-power LED lamp holder

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