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Electroplating method for lead frame

A lead frame and frame technology, applied in circuits, electrical components, electrical solid devices, etc., can solve the problem of silver leakage from the frame of the lead frame, and achieve the effect of solving the silver leakage phenomenon.

Active Publication Date: 2011-04-27
NINGBO KANGQIANG ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The electroplating method of the integrated circuit lead frame in the prior art all is to the lead frame after the full-page etching, and the lead frame that becomes strip-shaped after the piece is bent is electroplated, and the lead frame in the strip-shaped lead frame after the piece is bent The distance from the edge to the edge of the strip is short, and the frame of the lead frame is prone to silver leakage after electroplating by this plating method

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0014] 1. prepare wet film solution, the concentration of described wet film solution is 55%;

[0015] ②. After connecting the etched full-page lead frame with the bend position to the wire, put it into the wet film solution for electroplating, the electroplating time is 10-12 seconds, and the temperature is 40°C-50°C;

[0016] ③. Wash the full-page lead frame after electroplating in the previous step with clean water, and dry it in a conventional sawing furnace. The drying temperature is 90°C-100°C, and the drying time is 80-90 seconds;

[0017] ④. Expose the dried full-page lead frame. The exposure is required to be carried out in a dust-free environment. The final full-page lead frame is developed, and the development time is 120 to 140 seconds. After development, rinse with water and dry;

[0018] ⑤. After the full-page lead frame processed in step ④ is connected to the wire, put it into the electroplating solution for electroplating silver, and clean it with clean water ...

Embodiment 2

[0021] 1. prepare wet film solution, the concentration of described wet film solution is 65%;

[0022] ②. After connecting the etched full-page lead frame with the bend position to the wire, put it into the wet film solution for electroplating. The electroplating time is 11-15 seconds and the temperature is 45°C-60°C;

[0023] ③. Clean the full-page lead frame after electroplating in the previous step with clean water, and dry it in a conventional sawing furnace. The drying temperature is 95°C-110°C, and the drying time is 30-80 seconds;

[0024] ④. Expose the dried full-page lead frame. The exposure is required to be carried out in a dust-free environment. The final full-page lead frame is developed, and the development time is 140 to 180 seconds. After development, rinse with water and dry;

[0025] ⑤. After the full-page lead frame processed in step ④ is connected to the wire, put it into the electroplating solution for electroplating silver, and clean it with clean water ...

Embodiment 3

[0028] 1. prepare wet film solution, the concentration of described wet film solution is 75%;

[0029] ②. After connecting the etched full-page lead frame with the slant position to the wire, put it into the wet film solution for electroplating. The electroplating time is 10-12 seconds and the temperature is 50-60 ℃;

[0030] ③. Clean the full-page lead frame after electroplating in the previous step with clean water, and dry it in a conventional sawing furnace. The drying temperature is 100°C-110°C, and the drying time is 60-80 seconds;

[0031] ④. Expose the dried full-page lead frame. The exposure is required to be carried out in a dust-free environment. The final full-page lead frame is developed, and the development time is 130 to 160 seconds. After development, rinse with water and dry;

[0032] ⑤. After the full-page lead frame processed in step ④ is connected to the wire, put it into the electroplating solution for electroplating silver, and clean it with clean water ...

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PUM

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Abstract

The invention provides an electroplating method for a lead frame. The method comprises the following steps of: 1) preparing wet film solution; 2) putting an etched full-page lead frame with a sheet position into the wet film solution for electroplating; 3) washing the full-page lead frame electroplated in the previous step with clear water and drying; 4) exposing and developing; 5) putting into electroplating solution for electroplating silver; and 6) stripping the electroplated full-page lead frame, washing and drying. Compared with the prior art, the method has the advantages that: the lead frame is the etched full-page lead frame with the sheet position, and a distance exists between the edge of the lead frame in the full-page lead frame and the edge of the full page. Therefore, during silver electroplating, the silver cannot be leaked on the edge of the lead frame. Therefore, the method effectively solves the problem that the silver is leaked on the edge of the lead frame.

Description

Technical field: [0001] The invention relates to a method for manufacturing a lead frame, in particular to an electroplating method for the lead frame. Background technique: [0002] Lead frames of integrated circuits (such as QFN-quad flat no-lead package, QFP-four-side pin flat package, etc.) are the basic components for manufacturing integrated circuit semiconductor components. In order to meet the needs of manufacturing integrated circuit semiconductor components, the local area of ​​the lead frame surface of the integrated circuit needs to be plated with metal silver or nickel-palladium gold, and the rest of the part does not require plating, otherwise it cannot meet the needs of manufacturing integrated circuit semiconductor components, so the integrated circuit lead When the frame is electroplated, an electroplating mask needs to be used to protect the part of the surface that does not need to be electroplated. The electroplating method of the integrated circuit lead...

Claims

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Application Information

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IPC IPC(8): C25D7/00C25D5/02H01L23/48
Inventor 郑康定黎超丰刘松源邓道斌郑行彬黄伟金琦峰
Owner NINGBO KANGQIANG ELECTRONICS CO LTD