Ultra-wide lead frame electroplating assembly line and its production process
A technology of ultra-wide lead wires and wide-row lead wires, which is applied in the field of ultra-wide lead frame electroplating line and its production process, which can solve problems such as uneven force, silver leakage, and wrinkles at the contact position between the belt and the product, and achieve the electroplating effect Good, even force effect
Active Publication Date: 2018-05-29
NINGBO KANGQIANG ELECTRONICS CO LTD
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Problems solved by technology
[0002] The traditional lead frame electroplating line can only be applied to the electroplating of lead frames with a width of less than 70mm. The reason is that the main material of the belt is silica gel, and the secondary material is non-rigid material. unevenness, causing wrinkles where the belt contacts the product (e.g. figure 1 ) resulting in leakage of silver at this position
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[0027] see Figure 2-Figure 4 , the present invention relates to an ultra-wide lead frame electroplating line, which includes a first electroplating device 1 and a second electroplating device 2 arranged in sequence from front to back;
[0028] The first electroplating device 1 sequentially includes the front guide wheel 1.1 of the first electroplating device, the first electroplating mold 1.2, and the rear guide wheel 1.3 of the first electroplating device. The mold front support roller 1.4 and the first electroplating mold rear support roller 1.5, the first electroplating mold 1.2 is equipped with a fixed first electroplating mold anode 1.6 and the first liquid injection device 1.11, and the first half of the first electroplating mold 1.2 is set There is a first pressure-coating belt 1.7, and the first pressure-coating belt 1.7 is tensioned by three first pulleys 1.8 located above, in front of and behind the first electroplating mold 1.2, and the upper first pulley 1.8 is co...
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The invention relates to an ultra-wide-row and high-precision lead frame electroplating assembly line. The assembly line comprises a first electroplating device (1) and a second electroplating device (2) which are arranged sequentially from front to back; a first covering and pressing belt (1.7) is closely attached to the right half section of a first electroplating mold (1.2); and a second covering and pressing belt (2.7) is closely attached to the left half section of a second electroplating mold (2.2). With the assembly line, traditional overall operation for ultra-wide-row and high-precision lead frames is improved into respective liquid spraying on the left side and the right side, two sides of the belts are uniformly stressed due to the fact that the covering and pressing belts are narrowed, the electroplating effect is good, and the silver leakage phenomenon can be avoided.
Description
technical field [0001] The invention relates to an electroplating assembly line of an ultra-wide row lead frame and a production process thereof. Background technique [0002] The traditional lead frame electroplating line can only be applied to the electroplating of lead frames with a width of less than 70mm. The reason is that the main material of the belt is silica gel, and the secondary material is non-rigid material. unevenness, causing wrinkles where the belt contacts the product (e.g. figure 1 ) resulting in silver leakage at this location. Therefore, it is particularly important to seek an ultra-wide lead frame electroplating line with good electroplating effect and no silver leakage phenomenon and its production process. Contents of the invention [0003] The purpose of the present invention is to overcome the above disadvantages and provide an ultra-wide lead frame electroplating line with good electroplating effect and no silver leakage phenomenon and its prod...
Claims
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IPC IPC(8): C25D17/00C25D5/08
CPCC25D5/08C25D17/001
Inventor 孙华谢艳朱君凯李超群
Owner NINGBO KANGQIANG ELECTRONICS CO LTD