Static discharge test method

Abstract

The invention provides a static discharge test method, comprising the following steps of: providing a semiconductor device to be tested; dividing all input and output contacts which are disposed on the semiconductor device to be tested into a standby group and other groups; placing the semiconductor device to be tested on a pin frame of a test plate which is provided, wherein the input and outputcontacts of the a standby group and a power supply contact and a grounding contact of the semiconductor device to be tested are respectively and correspondingly connected to the pin of the pin frame of the test plate; then connecting all input and output contacts of other groups to a grounding plane of the pin frame of the test plate by means of common ground connection, and connecting the grounding plane to a common pin of the pin frame of the test plate; and then implementing the static discharge test. The static discharge test method provided by the invention has the advantages that the limitation to the contact amount of the semiconductor device to be tested in the prior art is solved without influencing the results of the test by means of the strategy of grouping, the time is saved, and the cost is reduced.

Description

technical field [0001] The invention relates to electrostatic discharge testing technology, in particular to an electrostatic discharge testing method for semiconductor devices. Background technique [0002] Electrostatic discharge (Electro Static Discharge; ESD) refers to the transfer of electrostatic charges between objects caused by direct contact or electrostatic induction of objects with different electrostatic potentials. It usually refers to the phenomenon that after the energy of the electrostatic field reaches a certain level, it breaks down the medium and discharges it. The instantaneous voltage generated when electrostatic discharge occurs can be as high as thousands of volts, which usually generates enough heat to melt the working circuit inside the semiconductor, causing immediate and irreversible damage, which we try our best to avoid. [0003] Therefore, ESD testing is required for semiconductor devices. [0004] At present, ESD is mainly divided into three ...

AI Technical Summary

Problems solved by technology

[0009] The purpose of the present invention is to provide an electrostatic discharge test method, which solves the problems in the prior art that the number of contact points of the semiconductor device to be tested is limited, and a special test board must be additionally reconfigured, resulting in time-consuming and cost-increasing problems.

Images