LED heat conducting seat and manufacture procedure thereof

Abstract

The invention relates to an LED heat conducting seat and a manufacture procedure thereof. The heat conducting seat is provided with a placement area, wherein the periphery of the placement area is provided with one or more fixed parts which are higher than the placement area; a compressing area is arranged on the fixed part; the compressing area on the fixed part is obliquely extruded by a die sothat materials of the fixed part are extruded from inner part to the upper part of the placement area to form a hooking part; and an LED lamp can be forcedly pressed and buckled in the placement area, the LED lamp can be tightly attached to the heat conducting seat, the effect of forced heat conduction is achieved, and the temperature of the LED lamp can be rapidly reduced.

Description

technical field [0001] The invention relates to an LED heat conduction seat and a manufacturing process thereof, in particular to an LED heat conduction seat with both fixing and forced heat conduction functions and a manufacturing method thereof. Background technique [0002] Commonly used LED lamps are equipped with a heat conducting part at the bottom of the LED chip. When the LED lamp is used for lighting, the heat generated can be transferred by the bottom heat conducting part to reduce the temperature of the LED lamp. [0003] However, the commonly used LED lamps and their heat-conducting parts are only set in contact with each other. In actual use, sometimes there will be poor contact or false connection, and the higher the brightness of the LED lamp, the more heat it will generate. For lamps such as traffic lights that combine multiple LED lights to form the lighting surface or marking surface, if the LED lights overheat due to poor heat conduction, it will not only ...

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is to overcome the disadvantages that the heat conduction efficiency may be low due to poor contact or virtual connection between the existing LED lamp and the heat conduction element, and the disadvantage that the LED lamp needs to install the heat conduction element on the printed circuit board, resulting in difficult installation. Based on years of rich practical experience and professional knowledge engaged in the design and manufacture of such products, the inventor actively researches and innovates in conjunction with the application of theories, in order to create a revolutionary LED heat transfer seat. The main purpose of the present invention is to hope that through this design, Provide an LED heat conduction structure superior to common LED heat conduction structures

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