Method for Determining Electromigration Lifetime of Interconnects

Abstract

The invention provides a method for determining electro-migration lifetime of interconnected lines, comprising the steps of: selecting at least three interconnected lines with different line widths; the at least three interconnected lines with different line widths are formed under a same determination technological condition; testing the failure times of different structures of each interconnected line and obtaining the average failure time corresponding to each interconnected line by utilizing statistic distribution; obtaining the normalized lifetime of each interconnected line according to black equation when temperature density and current density are determined; fitting to obtain secondary function relations between the normalized lifetimes and the line widths of the interconnected lines; and obtaining the electro-migration lifetime under the worst condition through curves corresponding to the secondary function relations so as to obtain the line widths corresponding to the electro-migration lifetime under the worst condition. By adopting the method provided by the invention, the electro-migration lifetime of the interconnected lines under the worst condition can be precisely evaluated and important information is provided for the technologies of metal development.

Description

technical field [0001] The invention relates to the field of semiconductor testing, in particular to a method for determining the electromigration lifetime of an interconnection line. Background technique [0002] The electromigration of metal interconnection lines is the main reliability problem in microelectronic devices. When the metal lines are energized, the metal atoms migrate under the push of electrons, resulting in short circuits or open circuits of metal lines. Therefore, metal electromigration is a reliable method for integrated circuits. One of the important contents of sexual assessment. The reliability evaluation of integrated circuits in the industry is performed according to the JEDEC standard. According to the requirements of the JEDEC standard, the electromigration of metal lines not only needs to evaluate the lines with the minimum line width stipulated by the design rules, but also needs to evaluate the lines with a width greater than the average grain si...

AI Technical Summary

Problems solved by technology

[0004] In order to solve the existing technology, when formulating the reliability evaluation structure, the metal line width in the worst case is defined by experience or by referring to the structure of the process generation of other manufacturers, and the reliability life in the worst case cannot be obtained. Problem, the present invention provides a method for determining the electromigration lifetime of interconnection wires

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