Adhesive for high-temperature-resistant masking tape and high-temperature-resistant masking tape

Abstract

The invention discloses an adhesive for a high-temperature-resistant masking tape. The adhesive for the high-temperature-resistant masking tape is characterized by comprising the following components in percentage by weight: 30 to 50 percent of natural rubber, 10 to 20 percent of synthetic rubber, 4 to 20 percent of viscous resin, 0.5 to 4 percent of anti-aging agent, 1 to 5 percent of filler, 0.2 to 3 percent of vulcanization auxiliary agent, 2 to 5 percent of vulcanizing agent and the balance of solvent. The adhesive for the high-temperature-resistant masking tape has high temperature resistance and normal hot stripping and cold stripping indexes after being used continuously at the temperature of 150 DEG C for 60 minutes. The adhesive is applied to adhesion at the temperature of 150 DEG C without degumming and cracking and is particularly applied to high-temperature environments such as automobile baking varnish, an electronic circuit board and the like.

Description

Technical field [0001] The invention relates to an adhesive for a high temperature resistant masking tape and a high temperature resistant masking tape. Background technique [0002] During the production and use of automobiles, it is often necessary to spray paint and bake paint on multiple parts of the automobile, especially the outer surface. But not every part of the outer surface needs the same painting and baking treatment; and in the process, most of them need to be polished and repaired after the painting and baking are completed. [0003] In order to perform different painting and baking treatments on various parts, some parts need to be masked. Simple methods can be used for masking, such as using cardboard to cover parts that do not require treatment or require other special treatment. But this method is inefficient and troublesome to operate. [0004] The commonly used masking method is to use masking tape, that is, use a tape with a certain adhesiveness and stick it o...

AI Technical Summary

Problems solved by technology

If the tape used cannot meet the requirements of high temperature resistance, it is easy to degumming and crack when the temperature of the circuit board rises, resulting in damage to the circuit board

[0007] The adhesive tapes used in the prior art are difficult to meet the requirements of high temperature use, and the high temperature resistance is poor

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