Adhesive for high-temperature-resistant masking tape and high-temperature-resistant masking tape

Abstract

The invention discloses an adhesive for a high-temperature-resistant masking tape. The adhesive for the high-temperature-resistant masking tape is characterized by comprising the following components in percentage by weight: 30 to 50 percent of natural rubber, 10 to 20 percent of synthetic rubber, 4 to 20 percent of viscous resin, 0.5 to 4 percent of anti-aging agent, 1 to 5 percent of filler, 0.2 to 3 percent of vulcanization auxiliary agent, 2 to 5 percent of vulcanizing agent and the balance of solvent. The adhesive for the high-temperature-resistant masking tape has high temperature resistance and normal hot stripping and cold stripping indexes after being used continuously at the temperature of 150 DEG C for 60 minutes. The adhesive is applied to adhesion at the temperature of 150 DEG C without degumming and cracking and is particularly applied to high-temperature environments such as automobile baking varnish, an electronic circuit board and the like.

Description

technical field [0001] The invention relates to an adhesive for a high-temperature-resistant masking tape and a high-temperature-resistant masking tape. Background technique [0002] In the process of automobile production and use, it is often necessary to paint and bake the various parts of the automobile, especially the outer surface. However, not every part of the outer surface requires the same painting and baking treatment; and during the treatment process, most of them need to be painted and baked, and then need to be polished and repaired. [0003] In order to carry out different painting and baking treatments on various parts, some parts need to be covered. Simple methods can be used for shielding, such as using cardboard to cover parts that do not need to be treated or require other special treatment. But this method is inefficient and cumbersome to operate. [0004] The commonly used masking method is to use masking tape, that is, use a certain adhesive tape to ...

AI Technical Summary

Problems solved by technology

If the tape used cannot meet the requirements of high temperature resistance, it is easy to degumming and crack when the temperature of the circuit board rises, resulting in damage to the circuit board

[0007] The adhesive tapes used in the prior art are difficult to meet the requirements of high temperature use, and the high temperature resistance is poor

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